Serial #79452888 Trademark

Scientific and technological services; product development; designing semiconductor chips; research and development of photonic products; research in the field of semiconductor processing technology; consultancy, design, research, development, production and advisory services related thereto in the field of semiconductor chips; technical advice regarding the production of semiconductors; research and development of substrate removal processes, thin-film coating processes, thermal integration, and management of electrical and electronic components; development and implementation of thermally, optically and electrically functional thin-film materials; designing semiconductor chips, lasers, transistors, PICs and integral circuits; technical research and consultancy related thereto in the field of the manufacturing of photonic silicon chips; development of software for (photonic) semiconductors; development of software for simulation, analysis, and process control of thin-film technology and thermal management.

Material processing on wafers, semiconductors, and optical components, including the application of thin-film layers; processing of semiconductor wafers; semiconductor encapsulation; applying a thin film layer to optical components; processing of electronic components to optimize heat dissipation and performance; applying thermally conductive or heat-dissipating layers to electronic components; material processing, namely substrate separation and removal of electronic or optoelectronic components; customer-specific manufacturing of semiconductor wafers, semiconductor circuits, semiconductor components, devices, and circuits.

Electric and electronic components; electrical circuits and printed circuit boards; III-V thin-film devices; wafers for integrated circuits; coolers for electronic components; photonic chips; photonic integrated circuits (PICs); indium phosphide chips and semiconductors; III-V semiconductors; chips for integrated circuits; semiconductor lasers; microprocessors; semi-conductor devices; semi-conductor chips; semiconductor modules; semiconductor substrates; semiconductor sensors; semiconductor transistors; thin-film materials, namely thermally conductive, optical, and electrically functional layers for application on semiconductors, optical components, and wafers; thin-film devices manufactured from III-V materials, with thermal functions, including for applications in photonics, radio frequency, and power electronics; electronic and optoelectronic components with integrated thin-film layers for thermal management or signal processing; integrated circuits (ICs); interfaces; electronic chips for the manufacture of integrated circuits.