COOLSEM Trademark

Material processing on wafers, semiconductors and optical components, including the application of thin-film layers; semiconductor wafer processing; semiconductor encapsulation; applying a thin film layer to optical components; machining of electronic components to optimize heat dissipation and performance; applying thermally conductive or heat-dissipating layers to electronic components; material processing, namely substrate separation and removal of electronic or optoelectronic components; custom manufacturing of semiconductor wafers, semiconductor circuits, semiconductor components, devices and circuits.

Electric and electronic components; electrical circuits and printed circuit boards; III-V thin-film devices; wafers for integrated circuits; coolers for electronic components; photonic chips; photonic integrated circuits (PICs); indium phosphide chips and semiconductors; III-V semiconductors; integrated circuit chips; semiconductor lasers; microprocessors; semi-conductor devices; semi-conductor chips; semiconductor modules; semiconductor substrates; semiconductor sensors; semiconductor transistor; thin-film materials, namely thermally conductive, optical and electrically functional layers for application on semiconductors, optical components and wafers; thin-film devices made of III-V materials, with thermal functions including for applications in photonics, radio frequency and power electronics; electronic and optoelectronic components with integrated thin-film layers for thermal management or signal processing; integrated circuits; interfaces; electronic chips for the manufacture of integrated circuits.

Scientific and technological services; product development; semiconductor chip design; research and development of photonic products; research in the field of semiconductor processing technology; consulting, design, research, development, production and advice in the field of semiconductor chips; technical consultancy in relation to the production of semiconductors; research and development of substrate removal processes, thin-film layer processes, thermal integration and management of electrical and electronic components; development and implementation of thermally, optically and electrically functional thin-film materials; designing semiconductor chips, lasers, transistors, PICs and integral circuits; technical research and consultancy in the field of photonic silicon chip manufacturing; development of software for (photonic) semiconductors; development of software for simulation, analysis and process control of thin-film technology and thermal management.