Serial Number
98269494
Owner
JCU CORPORATIONAttorney
Barry I. HollanderFirst Use Date
Nov 20, 2023
Filing Date
Nov 14, 2023
TIPHARES Trademark
Serial Number: 98269494 • Registration: 7804895
Trademark Classes
Owner Contact Info
Legal Representation
Correspondence Address
Barry I. Hollander GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191-1411
United States
Trademark Details
Filing Date
November 14, 2023
Registration Date
May 20, 2025
First Use Anywhere
November 20, 2023
First Use in Commerce
December 20, 2024
Published for Opposition
October 22, 2024
Goods & Services
Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards