NEZARK
LIVE

Serial Number

98269503

Owner

JCU CORPORATION

Attorney

Barry I. Hollander

Filing Date

Nov 14, 2023

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NEZARK Trademark

Serial Number: 98269503

NEZARK is a trademark filed by JCU CORPORATION on November 14, 2023. The trademark is classified under Class 1 (Chemicals). The application is currently pending registration.

Owner Contact Info

JCU CORPORATION (8 trademarks)

8-1, HIGASHIUENO 4-CHOME
TAITO-KU, TOKYO , JP

Entity Type: 03

Trademark Details

Filing Date

November 14, 2023

Registration Date

Not Registered

Published for Opposition

October 22, 2024

Goods & Services

Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards

Filing History

TEAS STATEMENT OF USE RECEIVED
Mar 24, 2026 EISU
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Nov 26, 2025 EXRA
SOU EXTENSION 2 GRANTED
Nov 25, 2025 EX2G
SOU EXTENSION 2 FILED
Nov 25, 2025 EXT2
SOU TEAS EXTENSION RECEIVED
Nov 25, 2025 EEXT
NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
May 9, 2025 EXRA
SOU EXTENSION 1 GRANTED
May 8, 2025 EX1G
SOU EXTENSION 1 FILED
May 8, 2025 EXT1
SOU TEAS EXTENSION RECEIVED
May 8, 2025 EEXT
NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Dec 3, 2024 NOAM
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Oct 22, 2024 NPUB
PUBLISHED FOR OPPOSITION
Oct 22, 2024 PUBO
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Oct 2, 2024 NONP
APPROVED FOR PUB - PRINCIPAL REGISTER
Sep 12, 2024 CNSA
EXAMINER'S AMENDMENT ENTERED
Sep 12, 2024 XAEC
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Sep 12, 2024 GNEN
EXAMINERS AMENDMENT E-MAILED
Sep 12, 2024 GNEA
EXAMINERS AMENDMENT -WRITTEN
Sep 12, 2024 CNEA
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Jun 22, 2024 GNRN
NON-FINAL ACTION E-MAILED
Jun 22, 2024 GNRT
NON-FINAL ACTION WRITTEN
Jun 22, 2024 CNRT
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Jun 20, 2024 GNRN
NON-FINAL ACTION E-MAILED
Jun 20, 2024 GNRT
NON-FINAL ACTION WRITTEN
Jun 20, 2024 CNRT
ASSIGNED TO EXAMINER
Jun 20, 2024 DOCK
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Dec 19, 2023 NWOS
NEW APPLICATION ENTERED
Nov 17, 2023 NWAP