SMARTSIC
LIVE

Serial Number

79349728

Owner

SOITEC

Attorney

Mari-Elise Paul

Filing Date

Mar 31, 2022

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SMARTSIC Trademark

Serial Number: 79349728

SMARTSIC is a trademark filed by SOITEC on March 31, 2022. The trademark is classified under Class 9 (Computers & Electronics), Class 40 (Treatment & Processing), Class 42 (Computer & Scientific). The application is currently pending registration.

Owner Contact Info

SOITEC (17 trademarks)

Parc Technologique des Fontaines -

Entity Type: 99

Trademark Details

Filing Date

March 31, 2022

Registration Date

Not Registered

Goods & Services

Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing and gluing of semiconductor material surfaces all of the above being part of custom manufacture; treatment of semiconductor substrates for microelectronics, optoelectronics, microsystems, radio frequency (RF) or power components, photonics; treatment of materials in the nature of semiconductor wafers and semiconductors; polishing semiconductor wafers; transferring a layer of materials, semiconductors or components to any media being part of custom manufacturing; treatment of materials, namely, ion implantation in materials; treatment of materials, namely, deposing layers of materials, especially Chemical Vapor Deposition or Physical Vapor Deposition of thin layers; treatment of materials, namely, custom manufacturing by sublimation, such as manufacturing by Physical Vapor Transport; treatment of materials, namely, growth of material layers, especially in epitaxy; treatment of materials, namely, manufacturing by powder sintering processes

Testing semiconductor materials; research and development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; research and development of new products in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; engineering and engineering services in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering electric radio frequency currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; engineering and engineering services in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; technical assistance and support services, namely, technical engineering advice for the development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; technical assistance and support services, namely, technical engineering advice for the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material layer transfer, semiconductors or components on all media, in the field of ion implantation in materials, in the field of layer deposition of materials, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as being Physical Vapor Transport, in the field of powder sintering process manufacturing

Multi-layer substrates being a layered semiconductor; multilayer substrates consisting of semiconductor being a layered semiconductor for optoelectronics, microelectronics, photonics, integrated circuits, radio frequency (RF) or power electronic components, for transistors, thyristors and diodes, for microsystems, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes

Filing History

CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED
May 21, 2024 CORR
CORRECTION TRANSACTION RECEIVED FROM IB
Apr 29, 2024 CRCV
TEAS CHANGE OF CORRESPONDENCE RECEIVED
Apr 11, 2024 TCCA
TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
Apr 11, 2024 ECDR
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Apr 11, 2024 ARAA
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Apr 11, 2024 REAP
TEAS/EMAIL CORRESPONDENCE ENTERED
Apr 11, 2024 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Apr 11, 2024 CRFA
TEAS REQUEST FOR RECONSIDERATION RECEIVED
Apr 11, 2024 ERFR
NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
Mar 11, 2024 OPNX
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
Feb 21, 2024 OPNS
NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
Feb 21, 2024 OPNR
ASSIGNED TO EXAMINER
Dec 6, 2023 DOCK
NOTIFICATION OF FINAL REFUSAL EMAILED
Oct 11, 2023 GNFN
FINAL REFUSAL E-MAILED
Oct 11, 2023 GNFR
FINAL REFUSAL WRITTEN
Oct 11, 2023 CNFR
TEAS/EMAIL CORRESPONDENCE ENTERED
Sep 19, 2023 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Sep 18, 2023 CRFA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Sep 18, 2023 TROA
REFUSAL PROCESSED BY IB
Apr 13, 2023 RFNT
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Mar 19, 2023 RFCS
REFUSAL PROCESSED BY MPU
Mar 19, 2023 RFRR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Jan 25, 2023 RFCR
NON-FINAL ACTION WRITTEN
Jan 24, 2023 CNRT
ASSIGNED TO EXAMINER
Jan 18, 2023 DOCK
APPLICATION FILING RECEIPT MAILED
Sep 20, 2022 MAFR
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Sep 16, 2022 NWOS
SN ASSIGNED FOR SECT 66A APPL FROM IB
Sep 15, 2022 REPR