Serial Number
99082749
Owner
Lintec Kabushiki KaishaAttorney
Tomoko NakajimaFiling Date
Mar 13, 2025
PCBL Trademark
Serial Number: 99082749
Trademark Classes
Class 1 - Chemicals
Chemical products for industry, science, photography, agriculture, horticulture and forestry
Class 7 - Machinery
Machines and machine tools; motors and engines; machine coupling and transmission components
Class 40 - Treatment & Processing
Treatment of materials
Class 17 - Rubber Goods
Unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica
Owner Contact Info
Legal Representation
Correspondence Address
Tomoko Nakajima Future IP LLC
818 18th Street NW, Suite 810 #777
Washington, DC 20006
United States
Trademark Details
Filing Date
March 13, 2025
Registration Date
Not Registered
Published for Opposition
March 3, 2026
Goods & Services
Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin
Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets for use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips
semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors
laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastic films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer