DTB
LIVE

Serial Number

99595335

Owner

Lintec Kabushiki Kaisha

Attorney

Tomoko Nakajima

Filing Date

Jan 14, 2026

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DTB Trademark

Serial Number: 99595335

DTB is a trademark filed by Lintec Kabushiki Kaisha on January 14, 2026. The trademark is classified under Class 7 (Machinery), Class 40 (Treatment & Processing), Class 17 (Rubber Goods). The application is currently pending registration.

Owner Contact Info

Lintec Kabushiki Kaisha (40 trademarks)

Tokyo 173-0001 , JP

Entity Type: 03

TAZMO CO., LTD. (2 trademarks)

5311, HAGA, KITA-KU, OKAYAMA-SHI
OKAYAMA 701-1221 , JP

Entity Type: 03

Trademark Details

Filing Date

January 14, 2026

Registration Date

Not Registered

Goods & Services

Laminating of adhesive tapes and self-adhesive tapes; Peeling of adhesive tapes and self-adhesive tapes; Treatment and processing of plastic films and sheets; Electron beam irradiation treatment for resin; Treatment and processing of semiconductors or wafers; Resin coating processing of semiconductors or wafers; Rental of semiconductor manufacturing machines and apparatus

Semiconductor manufacturing machines; electric irradiation apparatus for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Apparatus for adhesion for use in the manufacture of semiconductors; Bonding apparatus for use in the manufacture of semiconductors; Die bonders; Mounting apparatus for mounting IC chips and other electronic components onto circuit boards

Plastic semi-worked products; Adhesive or adhesive-coated plastic films and plastic sheets; Adhesive tapes and self-adhesive tapes for use in the processing of semiconductors; Adhesive tapes and self-adhesive tapes for use in the mounting of semiconductors; Tapes for use in the peeling of tapes for semiconductor wafer processing; Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts; Protective tapes for the rear surfaces of semiconductor chips

Filing History

NOTIFICATION OF NON-FINAL ACTION E-MAILED
May 22, 2026 GNRN
NON-FINAL ACTION E-MAILED
May 22, 2026 GNRT
NON-FINAL ACTION WRITTEN
May 22, 2026 CNRT
ASSIGNED TO EXAMINER
May 13, 2026 DOCK
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
May 3, 2026 NWOS
APPLICATION FILING RECEIPT MAILED
Jan 14, 2026 MAFR
NEW APPLICATION ENTERED
Jan 14, 2026 NWAP