Serial Number
76360995
Owner
Advanpack Solutions Pte Ltd.Attorney
Lawrence N. GinsbergFiling Date
Jan 22, 2002
CU.P BUMP Trademark
Serial Number: 76360995
Trademark Classes
Owner Contact Info
Blk 33 Marsiling Industrial Estate Road 3, #03-01/03
Singapore 739256 , SG
Entity Type: 99
Legal Representation
Trademark Details
Filing Date
January 22, 2002
Registration Date
Not Registered
Published for Opposition
September 14, 2004
Goods & Services
Custom manufacture of bumps, namely conductive material, including copper, on an integrated circuit or semiconductor wafter; custom semiconductor bumping services; custom electroplating of conductive material on integrated circuits or semiconductor wafers; custom pillar bumping services
conductive interconnect components, containing copper, on and extending from, an integrated circuit or semiconductor wafer, flip chip interconnect components, namely, flip chip on lead frames, flip chip on substrates and micro electromechanical systems; pillar bump components, namely, wafer level chips skill package and micro electromechanical systems; integrated circuit interconnect components, namely, chip on chip components for micro electromechanical systems
