CU.P BOND Trademark

Serial Number: 76330816

CU.P BOND is a trademark filed by Advanpack Solutions Pte Ltd. on October 29, 2001. The trademark is classified under Class 9 (Computers & Electronics), Class 40 (Treatment & Processing). The application is currently no longer active.

Trademark Classes

Class 9 - Computers & Electronics

Scientific, nautical, surveying, photographic, cinematographic, optical apparatus and instruments

Class 40 - Treatment & Processing

Treatment of materials

Owner Contact Info

Advanpack Solutions Pte Ltd. (2 trademarks)

Blk 33 Marsiling Industrial Estate Road 3, #03-01/03
Singapore 739256 , SG

Entity Type: 99

Legal Representation

Attorney of Record

Lawrence N. Ginsberg

112 trademarks filed View all →

Trademark Details

Filing Date

October 29, 2001

Registration Date

Not Registered

Goods & Services

Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services

Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect