XSP - TRANSFORMABLE SUBTRACTIVE PACKAGE Trademark

Serial Number: 78120176

XSP - TRANSFORMABLE SUBTRACTIVE PACKAGE is a trademark filed by MTBSolutions, Inc. on April 8, 2002. The trademark is classified under Class 35 (Advertising & Business). The application is currently no longer active.

Trademark Classes

Class 35 - Advertising & Business

Advertising; business management; business administration; office functions

Owner Contact Info

MTBSolutions, Inc.

1630 Oakland Rd.
San Jose, CA 95131

Entity Type: 03

ASE Electronics (M) Sdn. Bhd.

Bayab Lepas Free Trade Zone
Penang 11900 , MY

Entity Type: 03

Amitec Ltd.

P.O. Box 631
Migdal Haemek 10556 , IL

Entity Type: 03

Trademark Details

Filing Date

April 8, 2002

Registration Date

Not Registered

Goods & Services

high performance semiconductor packaging technology integrating silicon die and package to create improved component performance, speed and reduced form factor