VENTEC Trademark
Serial Number: 87075993 • Registration: 5532667
Trademark Classes
Owner Contact Info
Unit 1, Trojan Business Park, Tachbrook
Warwickshire CV346RH , GB
Entity Type: 99
Legal Representation
Correspondence Address
Richard Y. Kim Snell & Wilmer L.L.P.
One East Washington Street, Suite 2700
Phoenix, AZ 85004-2556
United States
Trademark Details
Filing Date
June 17, 2016
Registration Date
August 7, 2018
Published for Opposition
May 22, 2018
Goods & Services
Electrical insulating materials; base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of circuit boards, namely, semi-processed plastic; plastic materials in the form of plates and sheets for use in the manufacture of circuit boards
Design services in the field of electrical insulating materials, base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of circuit boards, namely, semi-processed plastic, plastic materials in the form of plates and sheets for use in the manufacture of circuit boards
