ULTIMABOND Trademark

Semiconductor manufacturing machines; parts of semiconductor manufacturing machine; laminated semiconductor chip manufacturing machines; parts of laminated semiconductor chip manufacturing machines; substrate parts for semiconductor manufacturing machines, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; substrate parts for semiconductor manufacturing machines, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; substrate parts for semiconductor manufacturing machines, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp); substrate parts for semiconductor manufacturing machines, namely, ceramic substrates for holding semiconductor substrates in the semiconductor substrate fabrication process; ceramic heaters being machine parts for semiconductor manufacturing machines; electrostatic chucks being machine parts for semiconductor manufacturing machines.

Semiconductor wafers; telecommunication machines and apparatus namely, smartphones, mobile phones, telephones, wireless communication apparatus, receivers automatic switching apparatus for telecommunication; optical modulators for optical communications, telecommunication apparatus and quantum computers; optical communication devices, namely, laser diodes, optical isolators, photo diodes, optical amplifiers, optical switches; quantum computers; quantum dot light-emitting diodes [QLED]; quantum dots, namely, crystalline semi-conductor materials; quantum sensors in the nature of accelerometers, gravimeters, atomic clocks, magnetometers, gyroscopes, acoustic sensors, interferometers, superconducting quantum interference devices (SQUIDs), and photon detectors; electrical signal producing devices, namely, oscillators, frequency generators, clock generators, crystal oscillators, atomic clocks; wafers and substrates in the nature of electronic components for optical modulators; wafers and substrates in the nature of electronic components for optical communication devices; wafers and substrates in the nature of electronic components for quantum devices; wafers and substrates in the nature of electronic components for electrical signal producing devices; structural parts of optical modulators for optical communications, for telecommunication apparatus and for quantum computers, optical communication devices, namely, laser diodes, optical isolators, photo diodes, optical amplifiers and optical switches, quantum computers, quantum dot light-emitting diodes (QLED), quantum dots, namely, crystalline semi-conductor materials, quantum sensors for environmental monitoring, medical imaging and diagnostics, semiconductor inspection, high-precision positioning and navigation systems, electrical signal producing devices, namely, oscillators, frequency generators, clock generators, crystal oscillators, atomic clocks, wafers and substrates in the nature of electronic components for optical modulators, wafers and substrates in the nature of electronic components for optical communication devices, wafers and substrates in the nature of electronic components for quantum devices, wafers and substrates in the nature of electronic components for electrical signal producing devices; integrated circuits and their structural parts; circuit boards; surface acoustic wave filters; wafers and substrates being structural parts of surface acoustic wave filters; light-emitting diodes; substrates being structural parts of light-emitting diodes; laser diodes; substrates being structural parts of laser diodes; ceramic semiconductor wafers; ceramic substrates being structural parts of electronic circuits used in semiconductor manufacturing processes.