UCIE Trademark

Serial Number: 99231708 • Registration: 8109727

UCIE is a trademark filed by Universal Chiplet Interconnect Express, Inc. on June 12, 2025. The trademark is classified under Class 42 (Computer & Scientific), Class 16 (Paper Goods), Class 35 (Advertising & Business). The application is currently registered and active.

Trademark Classes

Class 42 - Computer & Scientific

Scientific and technological services; industrial analysis and research services

Class 16 - Paper Goods

Paper and cardboard; printed matter; bookbinding material; photographs; stationery

Class 35 - Advertising & Business

Advertising; business management; business administration; office functions

Owner Contact Info

Universal Chiplet Interconnect Express, Inc. (3 trademarks)

3855 SW 153rd Drive
Beaverton, OR 97003

Entity Type: 54

Legal Representation

Attorney of Record

Frank X. Curci

182 trademarks filed View all →

Correspondence Address

Frank X. Curci Buchalter, PC

805 S.W. Broadway, Suite 1500

Portland, OR 97205

United States

Trademark Details

Filing Date

June 12, 2025

Registration Date

January 20, 2026

First Use Anywhere

June 23, 2022

First Use in Commerce

June 23, 2022

Published for Opposition

December 2, 2025

Goods & Services

Developing and establishing voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, and technical documents for the same

Printed material, namely, technical documents featuring voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects

Association services, namely, promoting the design and development of voluntary technical specifications and standards for interconnects for integrated circuits and other silicon components used for processing, memory, storage, and communication, and for power-efficient and high-speed enhancements to such interconnects, for its members