Serial Number
78210691
Owner
OBARA GROUP INCORPORATEDAttorney
Daniel M. GurfinkelFiling Date
Feb 4, 2003
Serial #78210691 Trademark
Serial Number: 78210691 • Registration: 3084375
Trademark Classes
Class 3 - Cosmetics & Cleaning
Bleaching preparations and other substances for laundry use; cleaning, polishing, scouring
Class 7 - Machinery
Machines and machine tools; motors and engines; machine coupling and transmission components
Class 9 - Computers & Electronics
Scientific, nautical, surveying, photographic, cinematographic, optical apparatus and instruments
Owner Contact Info
3-2-10 CHUO-RINKAN-ANNEX, CHUO-RINKAN,
KANAGAWA 242-0007 , JP
Entity Type: 03
Legal Representation
Correspondence Address
Daniel M. Gurfinkel Dennemeyer & Associates, LLC
230 W. Monroe St.
Suite 2100
Chicago, IL 60606
United States
Trademark Details
Filing Date
February 4, 2003
Registration Date
April 25, 2006
Published for Opposition
January 31, 2006
Goods & Services
Measuring apparatus for measuring electrical characteristics, optical characteristics, surface roughness, shape, and surface flaws of metal, glass, crystal, semiconductors and ceramic, namely, photographic cameras, lasers, laser scanners, displacement meters, thickness meters, interferometers, flatness testers, micrometers, microscopes, ohmmeters, optical lens sights, and thermometers; electric arc welders; electric welding apparatus, namely, welding electrodes, electrical controllers, inverters, electrical transformers, electrical power and control cables and lasers not for medical use
[ Metalworking machines, namely, punching machines, drilling machines, metal shaping machines, engraving machines and imprinters; bonded abrasives, namely, abrasive disks, abrasive wheels for metalworking, polishing and lapping machines; metal polishing machines; machines for chemical processing and electromechanical machines for use in semiconductor manufacturing, namely, polishing and lapping machines, plasma etching machines, laser etching machines, cleaning machines for cleaning plasma and lasers used in semiconductor manufacturing; plastic shaping machines; crystal and glass processing machines for the semiconductor industry, namely, shaping machines, polishing machines, etching machines and cleaning machines; bonded abrasives, namely, abrasive disks and abrasive wheels for crystal and glass processing machines; semiconductor manufacturing machines; bonded abrasives, namely, abrasive disks and abrasive wheels for semiconductor manufacturing machines; ceramic processing machines, namely, machines for shaping ceramics, polishing machines and cleaning machines; bonded abrasives, namely, abrasive disks and abrasive wheels for ceramic processing machines; grinding stones for grinding machines and grinding wheels; gas-operated, electric and laser welding machines; laser-operated metalworking machines; laser-operated machines for forming and cutting materials; and polishing pads for polishing machines. ]
[ Polishing and lapping chemicals for use with polishing and lapping machines to polish metal, glass, crystal, semiconductors, and ceramic; abrasive paper; abrasive cloth; polishing and lapping slurry for polishing and lapping machines to polish metal, glass, crystal, semiconductors and ceramic; and polishing and lapping diamond pellet for polishing and lapping machines to polish metal, glass, crystal, semiconductors and ceramic ]
