TORYZA Trademark

Surface treatment equipment for use in manufacture of semiconductors, namely, semiconductor wafer plating processing machines for use in manufacture; semiconductor manufacturing machines; metal plating machines for use in the manufacture of semiconductors; semiconductor wafers plating processing machines for use in the manufacture of semiconductors; surface treatment equipment for semiconductor wafers and integrated circuits, namely, metal plating processing machines system comprised of mixing machines, filter machines, spraying machines, plating bath machines, pumping machines, plating processing machines for use in surface treatment; semiconductor substrates manufacturing machines; semiconductor wafer processing machines; etching machines and equipment for semiconductor substrates; electrolessplating machines; electroplating machines; liquid metal processing tanks for electronic components and semiconductor wafer plating being parts of machines; chemical processing tanks being parts of machines; machines and equipment for use in manufacturing and processing electronic circuit printed boards, namely, metal plating processing machines system comprised of mixing machines, filter machines, spraying machines, plating bath machines, pumping machines, plating processing machines for use in surface treatment.

Chemicals for use in the manufacture of semiconductors; chemical surface treatment agents for use in the manufacture of electronic components; etchants for use in the manufacture of semi-conductors; plating removing preparations, namely, chemical agents for removing metal plating from microelectronic components and semiconductors; release solvent for photoresists being solvent type processing compositions for use in the electronics industry; chemicals for use in metal plating; industrial chemicals; chemicals for use in plating; plating preparations; chemical plating solutions, namely, lithium plating solutions, sodium plating solutions, aluminum plating solutions, magnesium plating solutions, chromium plating solutions, manganese plating solutions, iron plating solutions, cobalt plating solutions, nickel plating solutions, electroless nickel plating solutions, acid copper plating solutions, copper plating solutions, electroless copper plating solutions, zinc plating solutions, gallium plating solutions, germanium plating solutions, ruthenium plating solutions, electroless ruthenium plating solutions, rhodium plating solutions, electroless rhodium plating solutions, palladium plating solutions, electroless palladium plating solutions, silver plating solutions, electroless silver plating solutions, tin plating solutions, iridium plating solutions, platinum plating solutions, electroless platinum plating solutions, gold plating solutions, electroless gold plating solutions, bismuth plating solutions, electroless bismuth plating solutions; metal plating chemical compositions; chemical additives for metal plating chemical compositions; metal surface treatment agents, namely, chemical compositions for use in metal plating processes; chemicals for use in metal surface treatment, namely, chemical compositions for use in metal plating processes; chemical preparations for use in metal industries; catalytic agents; catalysts for chemical plating processes; ungluing preparations, namely, chemical solvents and degreasing solvents for use in manufacturing processes; etching agents being etching solutions for metals; etching agents being etching solutions for the surface of aluminum and aluminum alloys; etching agents being etching solutions for the surface of glass.