THERMALIGN
LIVE

Serial Number

78253550

Owner

SUSS MICROTEC SE

Attorney

KEITH E. GILMAN

Filing Date

May 23, 2003

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THERMALIGN Trademark

Serial Number: 78253550 • Registration: 3037506

THERMALIGN is a trademark filed by SUSS MICROTEC SE on May 23, 2003. The trademark is classified under Class 7 (Machinery), Class 9 (Computers & Electronics), Class 37 (Building & Construction), Class 42 (Computer & Scientific). The application is currently registered and active.

Owner Contact Info

SUSS MICROTEC SE (17 trademarks)

SCHLEI�HEIMER STRA�E 90
M�NCHEN 85748 , DE

Entity Type: 25

SÜSS MICROTEC SE (14 trademarks)

SCHLEIßHEIMER STRAßE 90
GARCHING 85748 , DE

Entity Type: 94

Süss MicroTec AG (10 trademarks)

Schleissheimer Str. 90
85748 Garching , DE

Entity Type: 03

Trademark Details

Filing Date

May 23, 2003

Registration Date

January 3, 2006

Published for Opposition

October 11, 2005

Goods & Services

Machines for the production of electronic, micromechanical and optical components

[ Installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; installation, repair and maintenance of cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; installation, repair and maintenance of wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; installation, repair and maintenance of probed apparatus equipped with a laser cutter or emission microscopes and working with software; installation, repair and maintenance of test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, flexible tools for pattern recognition ]

[ Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development; installation and maintenance of software for pattern recognition ]

Optical, electric and electronic equipment for the processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, Infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition

Filing History

AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Feb 25, 2026 ASGN
AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Feb 4, 2026 ASGN
NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
Jan 21, 2026 NA89
REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
Jan 21, 2026 RNL2
REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Jan 21, 2026 89AG
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Jan 21, 2026 APRE
TEAS SECTION 8 & 9 RECEIVED
Oct 15, 2025 E89R
COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Jan 3, 2025 REM2
NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
Nov 6, 2015 NA89
REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
Nov 6, 2015 RNL1
REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Nov 6, 2015 89AG
TEAS SECTION 8 & 9 RECEIVED
Nov 3, 2015 E89R
NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
Feb 11, 2012 NA85
REGISTERED - PARTIAL SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Feb 11, 2012 C15P
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Feb 11, 2012 APRE
REGISTERED - SEC. 8 (6-YR) & SEC. 15 FILED
Dec 29, 2011 815F
TEAS SECTION 8 & 15 RECEIVED
Dec 29, 2011 E815
REGISTERED-PRINCIPAL REGISTER
Jan 3, 2006 R.PR
PUBLISHED FOR OPPOSITION
Oct 11, 2005 PUBO
NOTICE OF PUBLICATION
Sep 21, 2005 NPUB
LAW OFFICE PUBLICATION REVIEW COMPLETED
Jun 25, 2005 PREV
ASSIGNED TO LIE
Jun 24, 2005 ALIE
APPROVED FOR PUB - PRINCIPAL REGISTER
Jun 21, 2005 CNSA
AMENDMENT FROM APPLICANT ENTERED
Jun 21, 2005 ACEC
CORRESPONDENCE RECEIVED IN LAW OFFICE
Jun 10, 2005 CRFA
PAPER RECEIVED
Jun 10, 2005 MAIL
INQUIRY TO SUSPENSION E-MAILED
Dec 17, 2004 GNSI
SUSPENSION INQUIRY WRITTEN
Dec 17, 2004 CNSI
LETTER OF SUSPENSION E-MAILED
Jun 17, 2004 GNSL
CORRESPONDENCE RECEIVED IN LAW OFFICE
May 27, 2004 CRFA
CORRESPONDENCE RECEIVED IN LAW OFFICE
May 27, 2004 CRFA
PAPER RECEIVED
May 27, 2004 MAIL
NON-FINAL ACTION E-MAILED
Nov 28, 2003 GNRT
ASSIGNED TO EXAMINER
Nov 20, 2003 DOCK
CASE FILE IN TICRS
Jul 22, 2003 CFIT
PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED
Jul 2, 2003 AMPX
CORRESPONDENCE RECEIVED IN LAW OFFICE
Jul 2, 2003 CRFA
PAPER RECEIVED
Jul 2, 2003 MAIL