SOLDER-SUB Trademark

Serial Number: 75330283 • Registration: 2189302

SOLDER-SUB is a trademark filed by Amerasia International Technology, Inc. on July 24, 1997. The trademark is classified under Class 1 (Chemicals). The application is currently no longer active.

Trademark Classes

1

Class 1 - Chemicals

Chemical products for industry, science, photography, agriculture, horticulture and forestry

Owner Contact Info

Amerasia International Technology, Inc. (27 trademarks)

P.O. Box 3081
Princeton, NJ 08540

Entity Type: 03

Trademark Details

Filing Date

July 24, 1997

Registration Date

September 15, 1998

First Use Anywhere

March 18, 1997

First Use in Commerce

March 18, 1997

Published for Opposition

June 23, 1998

Cancellation Date

June 18, 2005

Goods & Services

electrically conductive adhesive that can be screened or stenciled onto substrate and cured as adhesive

Filing History

CANCELLED SEC. 8 (6-YR)

Jun 18, 2005 C8..

REGISTERED-PRINCIPAL REGISTER

Sep 15, 1998 R.PR

PUBLISHED FOR OPPOSITION

Jun 23, 1998 PUBO

NOTICE OF PUBLICATION

May 22, 1998 NPUB

APPROVED FOR PUB - PRINCIPAL REGISTER

Apr 13, 1998 CNSA

NON-FINAL ACTION MAILED

Apr 6, 1998 CNRT

ASSIGNED TO EXAMINER

Mar 2, 1998 DOCK

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