Serial Number
97308042
Owner
ONTO INNOVATION INC.Attorney
Heather J. KliebensteinFirst Use Date
Dec 12, 2012
Filing Date
Mar 11, 2022
RUDOLPH TECHNOLOGIES Trademark
Serial Number: 97308042 • Registration: 7697965
Trademark Classes
Class 7 - Machinery
Machines and machine tools; motors and engines; machine coupling and transmission components
Class 9 - Computers & Electronics
Scientific, nautical, surveying, photographic, cinematographic, optical apparatus and instruments
Class 42 - Computer & Scientific
Scientific and technological services; industrial analysis and research services
Owner Contact Info
Legal Representation
Correspondence Address
Heather J. Kliebenstein MERCHANT & GOULD P.C.
P.O. BOX 2910
MINNEAPOLIS, MN 55402-0910
United States
Trademark Details
Filing Date
March 11, 2022
Registration Date
February 18, 2025
First Use Anywhere
December 12, 2012
First Use in Commerce
December 12, 2012
Published for Opposition
July 12, 2022
Goods & Services
Optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; Scientific instruments, based principally upon optical microscope, electron microscope, spectrophotometer, ellipsometer and scanning slit densitometer technology, for metrology purposes, namely, apparatus for measuring physical dimensions of samples and thicknesses of deposited films or for analyzing chemical composition of materials
Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine, components and operating software therefor sold as a unit for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components
Providing temporary use on online, non-downloadable process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogenous packaging, and other advanced packaging electronics technologies