RELIA-SUPERFILL
DEAD

Serial Number

77246823

Owner

eMAT Technology, LLC

Attorney

Dax Alvarez

Filing Date

Aug 3, 2007

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RELIA-SUPERFILL Trademark

Serial Number: 77246823

RELIA-SUPERFILL is a trademark filed by eMAT Technology, LLC on August 3, 2007. The trademark is classified under Class 1 (Chemicals). The application is currently no longer active.

Owner Contact Info

eMAT Technology, LLC (9 trademarks)

8248 Randolph Road NE
Moses Lake, WA 98837

Entity Type: 16

Trademark Details

Filing Date

August 3, 2007

Registration Date

Not Registered

Published for Opposition

January 29, 2008

Goods & Services

Chemicals for use in electrochemical metal deposition process to fabricate void-free damascene interconnects for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; precision analytical chemicals for use in analysis of chemicals in damascene interconnect plating

Filing History

ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED
Nov 24, 2008 MAB6
ABANDONMENT - NO USE STATEMENT FILED
Nov 24, 2008 ABN6
NOA MAILED - SOU REQUIRED FROM APPLICANT
Apr 22, 2008 NOAM
PUBLISHED FOR OPPOSITION
Jan 29, 2008 PUBO
NOTICE OF PUBLICATION
Jan 9, 2008 NPUB
LAW OFFICE PUBLICATION REVIEW COMPLETED
Dec 21, 2007 PREV
ASSIGNED TO LIE
Dec 21, 2007 ALIE
APPROVED FOR PUB - PRINCIPAL REGISTER
Nov 13, 2007 CNSA
ASSIGNED TO EXAMINER
Nov 8, 2007 DOCK
NOTICE OF PSEUDO MARK MAILED
Aug 9, 2007 MPMK
NEW APPLICATION ENTERED
Aug 8, 2007 NWAP