RELIA-SUPERFILL Trademark
Serial Number: 77246823
Trademark Classes
Owner Contact Info
Legal Representation
Trademark Details
Filing Date
August 3, 2007
Registration Date
Not Registered
Published for Opposition
January 29, 2008
Goods & Services
Chemicals for use in electrochemical metal deposition process to fabricate void-free damascene interconnects for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; precision analytical chemicals for use in analysis of chemicals in damascene interconnect plating