QCIA LINKFABRIC Trademark

Semiconductor substrates incorporating integrated interconnect structures; semiconductor substrates supporting localized electrical interconnects; semiconductor substrates supporting die-to-die and chiplet-to-chiplet communication; semiconductor substrates incorporating embedded bridge interconnects; silicon and silicon carbide substrates incorporating high-density signal-routing structures; semiconductor package substrates supporting heterogeneous integration and integrated-circuit connectivity; semiconductor substrates incorporating embedded, bridge-like and monolithic interconnect structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and advanced semiconductor packaging applications.