POLYIC
LIVE

Serial Number

79111318

Owner

PolyIC GmbH & Co. KG

Attorney

ANTHONY E. BENNETT

Filing Date

Aug 16, 2011

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POLYIC Trademark

Serial Number: 79111318 • Registration: 4362739

POLYIC is a trademark filed by PolyIC GmbH & Co. KG on August 16, 2011. The trademark is classified under Class 9 (Computers & Electronics), Class 42 (Computer & Scientific), Class 45 (Legal & Security Services), Class 17 (Rubber Goods). The application is currently registered and active.

Owner Contact Info

PolyIC GmbH & Co. KG (5 trademarks)

Tucherstrasse 2

Entity Type: 16

Trademark Details

Filing Date

August 16, 2011

Registration Date

July 9, 2013

Published for Opposition

April 23, 2013

Goods & Services

Research, development and technical consultancy in the field of electronics [, consultancy concerning and comprising technical analysis for franchising concepts in the field of electronics, including polymer electronics ] ; technical consultancy regarding possibilities for the use of electrical functional layers, particularly of transparent or translucent functional layers in the field of electronics and of electronic circuits and/or electronic components; research, development and design of electrical functional layers, particularly of transparent or translucent functional layers in the field of electronics and of electronic circuits and/or electronic components; * all aforementioned services not in relation with optical measuring and lighting systems, laser systems for measuring purposes, conductive adhesives *

[ Allocation of licences regarding intellectual property rights and copyrights regarding know-how in the field of electricity and electronics, including polymer electronics; * all aforementioned services not in relation with optical measuring and lighting systems, laser systems for measuring purposes, conductive adhesives * ]

Semiconductor, electrical, electronic and optical components, namely, electrical, electronic [ and optical switches, ] sensors, [ integrated circuits, ] [ capacitors, inductors, resistors, diodes, memory chips, data storage chips, transponder chips, blank electronic and optical data carriers, electronic and optical data carriers containing encoded and non-encoded data for identification and authentication of goods and documents and electronic products, for facilitating electronic communication, facilitating the exchange of information and for electronic signal processing, electronic and optical data carriers containing identification information such as serial numbers, device identification numbers and electronic communication addresses, solar cells, electrical and electronic switches and ] electronic circuits and also printed circuit boards; [ integrated circuits, active or passive electronic components, namely, transistors, diodes, resistors, capacitors, inductors, resistors, or integrated circuits; ] electrodes, electrical and electronic conductive paths, namely, [ conductive tracings on printed circuit boards and ] conductive tracings as part of electronic circuits, * except adhesives serving as electrodes or conductive paths * ; conductive pads, namely, electric and electronic contact areas and electric and electronic conductors [ and electric and electronic sockets ] ; [ antennas, ] electrical and electronic operator control elements, namely, touch-sensitive and tactile operator control elements, namely, touchpads, touch sensors, touch screens, [ tactile switches and ] tactile sensors, for integration into electronic apparatus and into electronic devices for electronic hand-held apparatus, for portable and mobile communication devices, for portable audio and video players, for computers, for control devices, for electronic apparatus and machines; [ visual display elements, namely, electronic and optical displays as components for electronic devices and apparatus; light-emitting diodes and laser diodes * as assembly parts *, displays, namely, ] [ LCD displays, OLED displays,] [ electrochromatic displays, electrophoretic displays; ] electrical components and electronic components and optical components and optoelectronic components and circuits, namely, [ electrical, electronic and optical switches, ] sensors; [ integrated circuits, capacitors, inductors, resistors, diodes, memory chips, data storage chips, transponder chips, blank electronic and optical data carriers, electronic and optical data carriers containing encoded and non-encoded data for identification and authentication of goods and documents and electronic products, for facilitating electronic communication, facilitating the exchange of information and for electronic signal processing, electronic and optical data carriers containing identification information such as serial numbers, device identification numbers and electronic communication addresses, solar cells, transistors * except optical measuring and lighting systems as well as laser systems for measuring purposes *; integrated circuits and components thereof; ] electrical functional layers and electronic functional layers, namely, completely and partially transparent and translucent electrodes and conductive paths; semiconductor components, electrical components, electronic components and optical components, namely, completely and partially transparent and translucent functional layers that are applied on flexible carrier substrates, the aforesaid functional layers consisting of non-conductive surface regions and conductive surface regions, whereas these conductive surface regions are in the form of conductive paths, conductive pads, matrix dots, grids and matrices of metal and of conductive polymers, * except conductive adhesives *; electrical functional layers and electronic functional layers, namely, non-conductive electrical structures and semi-conductive electrical structures and conductive electrical structures that are combined with electronic circuits and electronic components and applied on flexible carrier substrates; electrical and electronic functional layers, namely, [ printed organic electrical structures and ] inorganic electrical structures that are combined with electronic circuits and electronic components, * except conductive adhesives * ; [ all the aforementioned goods also being codable and with optically active interference layers, polarization layers, liquid crystal layers, optically active three-dimensional structures; ] foil sheets, foil sheetings, [ foil tapes, foil tapes as roll goods, ] stickers, tags, [ tapes, filaments, discs, cards, boards and packaging, ] these goods containing semiconductor components, electrical components, electronic components and optical components, [ integrated circuits, ] electrodes, conductive tracings, electronic conductors, touch sensors, [ electronic displays, optical displays, LCD displays, OLED displays, electro chromatic displays, electrophoretic displays, ] sensors, [ data storage chips, ] electrical structures

Semi-finished goods of plastics or primarily of plastics and semi-finished goods of polymers for manufacturing purposes, namely, for manufacturing stickers and labels, * except conductive adhesives * ; [ bands of plastics or primarily of plastics, neither for medical purposes nor for household purposes, for manufacturing purposes, and bands of polymers, neither for medical purposes nor for household purposes, for manufacturing purposes; filaments of plastics or primarily of plastics not for textiles, for manufacturing purposes; discs, cards, boards of plastics and primarily of plastics and polymers for manufacturing purposes; ] foils primarily of plastics and foils of polymers for manufacturing purposes, foil sheets primarily of plastics and foil sheets of polymers for manufacturing purposes, foil sheetings primarily of plastics and foil sheetings of polymers for manufacturing purposes; [ and foil tapes primarily of plastics and foil tapes of polymers for manufacturing purposes; ] foils primarily of plastics and foils of polymers for manufacturing purposes, foil sheets primarily of plastics and foil sheets of polymers for manufacturing purposes, foil sheetings primarily of plastics and foil sheetings of polymers for manufacturing purposes, [ and foil tapes primarily of plastics and foil tapes of polymers for manufacturing purposes, ] these goods for receiving electrical functional structures, electrodes and conductive paths; semi-finished goods of plastics and primarily of plastics and semi-finished goods of polymers for manufacturing stickers and labels, * except conductive adhesives, * [ bands of plastics and bands primarily of plastics and bands of polymers for manufacturing purposes, filaments of plastics and filaments primarily of plastics and filaments of polymers, not for textiles, for manufacturing purposes, discs of plastics and discs primarily of plastics and discs of polymers for manufacturing purposes, cards of plastics and cards primarily of plastics and cards of polymers for manufacturing purposes, boards of plastics and boards primarily of plastics and boards of polymers for manufacturing purposes, ] foils primarily of plastics and foils of polymers for manufacturing purposes, foil sheets primarily of plastics and foil sheets of polymers for manufacturing purposes, foil sheetings primarily of plastics and foil sheetings of polymers for manufacturing purposes, [ foil tapes primarily of plastics and foil tapes of polymers for manufacturing purposes, ] all these goods containing non-conductive and semi-conductive and conductive functional layers for use as electronic circuits and electronic components, * except adhesives serving as electrodes or conductive paths * ; semi-finished goods and components of plastics and primarily of plastics and polymers, namely, completely and partially transparent and translucent functional layers for manufacturing electronic functional layers, transparent and translucent electrodes and conductive paths; semi-finished goods of plastics or primarily of plastics and polymers, namely, completely or partially transparent and translucent functional layers on flexible carrier substrates with non-conductive surface regions and conductive surface regions, the conductive surface regions particularly in the form of conductive paths, conductive pads, matrix dots, grids and matrices also of metal and conductive polymers; [ stamping foils, hot-stamping foils, cold-stamping foils, transfer foils and laminating foils and also foil strips, primarily of plastics not for packaging purposes; stamping foils not for packaging purposes, hot-stamping foils, cold-stamping foils, transfer foils except for packaging purposes, comprising a carrier film, primarily of plastic and at least one transfer layer which can be detached from the carrier film for the purpose of application to a substrate; laminating foils, comprising a carrier film and further layers primarily of plastic for lamination onto a substrate and foil strips, primarily of plastics not for packaging purposes; ] semi-finished goods of plastics or primarily of plastics and/or polymers, namely, films, plastic laminates, [ laminating foils ] * except adhesives in form of separated foils or separated films * [ , stamping foils; semi-finished goods, namely, injection-moulded parts primarily of plastic materials and polymers for manufacturing semiconductor, electrical, electronic and optical components, namely, for manufacturing electrical, electronic and optical switches, sensors, integrated circuits, capacitors, inductors, transistors, resistors, diodes, memory chips, data storage chips, transponder chips, electronic and optical data carriers, solar cells, printed circuit boards, integrated circuits, coated with completely or partially transparent or translucent functional layers, particularly with completely or partially transparent or translucent electrodes or conductive tracings, particularly manufactured by means of foil decoration methods during the injection-moulding process; semi-finished goods, namely, injection-moulded parts for integration into electronic products primarily of plastic materials and polymers for receiving electronic circuits and electronic components, containing non-conductive and semi-conductive and conductive functional layers, particularly manufactured by means of foil decoration methods during the injection-moulding process ]

Filing History

INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE
Jan 30, 2026 INNA
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Nov 18, 2025 INPR
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Nov 17, 2025 INPR
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Nov 3, 2025 INPR
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Oct 28, 2025 INPR
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Oct 13, 2025 INPR
PARTIAL INVALIDATION PROCESSED BY THE IB
Sep 5, 2025 INNP
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Aug 10, 2025 INPR
PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB
Jul 2, 2025 INPS
INVALIDATION PROCESSED
Jul 2, 2025 INPC
NOTICE OF UPDATED REGISTRATION CONFIRMATION EMAILED
Mar 25, 2025 NURC
NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED
Mar 3, 2025 NA71
REGISTERED-SEC.71 ACCEPTED
Mar 3, 2025 71AG
AMENDMENT UNDER SECTION 7 - PROCESSED
Mar 3, 2025 A7OK
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Oct 15, 2024 INPR
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Jan 17, 2024 APRE
TEAS SECTION 71 RECEIVED
May 11, 2023 ES71
TEAS SECTION 7 REQUEST RECEIVED
Apr 19, 2023 ES7R
COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED
Jul 9, 2022 REM4
INTERNATIONAL REGISTRATION RENEWED
Sep 9, 2021 RNWL
PARTIAL INVALIDATION PROCESSED BY THE IB
Nov 21, 2020 INNP
PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB
Oct 12, 2020 INPS
INVALIDATION PROCESSED
Oct 7, 2020 INPC
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Sep 11, 2020 INPR
NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED
Jan 11, 2020 NA71
REGISTERED - PARTIAL SEC 71 ACCEPTED
Jan 11, 2020 71.P
TEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVED
Jan 10, 2020 EROP
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Jan 9, 2020 ARAA
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Jan 9, 2020 REAP
POST REGISTRATION ACTION MAILED - SEC.71
Jul 22, 2019 PR71
CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Jul 21, 2019 APRE
TEAS SECTION 71 RECEIVED
Jul 3, 2019 ES71
COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
Jul 9, 2018 REM3
INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE
Feb 5, 2015 INNA
CORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED
Aug 15, 2014 CORN
PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Aug 2, 2014 INPR
CORRECTION FROM THE IB EXAMINED, NO ACTION IS NEEDED
Apr 2, 2014 CORN
LIMITATION FROM THE IB EXAMINED, NO ACTION IS NEEDED
Apr 2, 2014 LIMN
CORRECTION TRANSACTION RECEIVED FROM IB
Feb 1, 2014 CRCV
LIMITATION OF GOODS RECEIVED FROM IB
Feb 1, 2014 LIMG
FINAL DECISION TRANSACTION PROCESSED BY IB
Jan 5, 2014 FINO
FINAL DISPOSITION NOTICE SENT TO IB
Dec 4, 2013 FICS
FINAL DISPOSITION PROCESSED
Dec 4, 2013 FIMP
LIMITATION FROM THE IB EXAMINED AND ENTERED
Dec 3, 2013 LIME
CORRECTION UNDER SECTION 7 - PROCESSED
Dec 2, 2013 COC.
ASSIGNED TO PARALEGAL
Dec 2, 2013 PLGL
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
Oct 9, 2013 FICR
LIMITATION OF GOODS RECEIVED FROM IB
Sep 28, 2013 LIMG
REGISTERED-PRINCIPAL REGISTER
Jul 9, 2013 R.PR
NOTIFICATION PROCESSED BY IB
Jun 22, 2013 GPNX
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Apr 23, 2013 NPUB
PUBLISHED FOR OPPOSITION
Apr 23, 2013 PUBO
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
Apr 3, 2013 OPNS
NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB
Apr 3, 2013 OP2R
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Apr 3, 2013 NONP
LAW OFFICE PUBLICATION REVIEW COMPLETED
Mar 19, 2013 PREV
APPROVED FOR PUB - PRINCIPAL REGISTER
Mar 14, 2013 CNSA
TEAS/EMAIL CORRESPONDENCE ENTERED
Mar 13, 2013 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Mar 12, 2013 CRFA
TEAS REQUEST FOR RECONSIDERATION RECEIVED
Mar 12, 2013 ERFR
TEAS CHANGE OF CORRESPONDENCE RECEIVED
Dec 14, 2012 TCCA
FINAL REFUSAL MAILED
Nov 29, 2012 CNFR
FINAL REFUSAL WRITTEN
Nov 29, 2012 CNFR
TEAS/EMAIL CORRESPONDENCE ENTERED
Nov 18, 2012 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Nov 18, 2012 CRFA
ASSIGNED TO LIE
Nov 9, 2012 ALIE
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Nov 2, 2012 TROA
REFUSAL PROCESSED BY IB
May 19, 2012 RFNT
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
May 3, 2012 RFCS
REFUSAL PROCESSED BY MPU
May 3, 2012 RFRR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
May 2, 2012 RFCR
NON-FINAL ACTION WRITTEN
May 1, 2012 CNRT
APPLICATION FILING RECEIPT MAILED
Apr 28, 2012 MAFR
ASSIGNED TO EXAMINER
Apr 24, 2012 DOCK
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Apr 24, 2012 NWOS
SN ASSIGNED FOR SECT 66A APPL FROM IB
Apr 21, 2012 REPR