PHIX Trademark
Serial Number: 97165829 • Registration: 7251652
Trademark Classes
Owner Contact Info
Legal Representation
Trademark Details
Filing Date
December 10, 2021
Registration Date
December 26, 2023
Published for Opposition
October 10, 2023
Goods & Services
Custom assembly of photonic devices and its structural components in specific applications and modules; custom assembly services concerning photonic devices and instruments for and on behalf of third parties; custom photonic manufacturing services in the field of photonic components and devices, particularly integrated circuits, photonic integrated circuits; hybrid multi-chip assembly and integration, namely, custom hybrid multi-chip assembly and heterogenous integration subassembly of photonic chips and multi-chips for others; fiber placement and photonic wire bonding on products of others, namely, custom manufacture of photonics; custom manufacturing of fiber arrays; custom assembling of optical fiber arrays for photonic integrated circuits, PIC's; custom assembly services concerning semiconductors, photonic chips, integrated circuits, and photonic integrated circuits
Technical research and engineering services in the field of photonics; design and development services concerning semiconductors, photonic chips, integrated circuits, and photonic integrated circuits; engineering services concerning the manufacture of PIC enabled modules; scientific and technical consultancy services concerning photonic technology solutions and photonic technology appliances; scientific and technical consultancy services concerning the evaluation, testing, design, and development of photonic chips, integrated circuits, photonic interfaces and semiconductors to assure compliance with industry standards; technical consultancy being technological consultation and design services concerning the integration of photonic integrated circuits into devices and the connection of same with other components, particularly optical fibers, amplifiers; developing packaging in the nature of packaging design and housing technology solutions for photonic integrated circuits
