PECOTEK Trademark

Wire bonding machine tools, namely, capillaries used in semiconductor wire bonding and manufacturing machines; Semiconductor manufacturing machines and bonding apparatus for semiconductor wire bonding and die bonding; Power operated pick up tool being a machine part of semiconductor manufacturing machines for moving semiconductor wafer die for use in manufacturing machines for semiconductors; Power tool parts, namely, holding collets for use in semiconductor manufacturing machines; Machine parts, namely, micro nozzles which are parts of semiconductor manufacturing machines; Epoxy dispensing tool, being a machine part of semiconductor manufacturing machines for dispensing epoxy for use in semiconductor manufacturing machines; Power operated ejector tool being a machine part for semiconductor manufacturing machines for separating semiconductor wafer die for use in semiconductor manufacturing machines; Machine apparatus, namely, machines for manufacturing semiconductors; Semiconductor wafer processing machines; Robots for industrial use; Machines and machine tools, namely, industrial robots; Metalworking machines; Semiconductor manufacturing machine parts, namely, ejector pins for use in semiconductor manufacturing machines; Machines for processing non-metallic mineral