Serial Number
79146126
Owner
Pac Tech - Packaging Technologies GmbHAttorney
Cynthia A. MoyerFiling Date
Mar 3, 2014
PACTECH MEMBER OF NAGASE GROUP Trademark
Serial Number: 79146126 • Registration: 4737094
Trademark Classes
Class 6 - Metal Goods
Common metals and their alloys; metal building materials; transportable buildings of metal
Class 7 - Machinery
Machines and machine tools; motors and engines; machine coupling and transmission components
Class 40 - Treatment & Processing
Treatment of materials
Class 42 - Computer & Scientific
Scientific and technological services; industrial analysis and research services
Owner Contact Info
Legal Representation
Correspondence Address
Cynthia A. Moyer Fredrikson & Byron, P.A.
60 South Sixth Street
Suite 1500
Minneapolis, MN 55402
United States
Trademark Details
Filing Date
March 3, 2014
Registration Date
May 19, 2015
Published for Opposition
March 3, 2015
Goods & Services
Contact metalizations for microconnections made from soldering material, included in class 6, namely, soldering wire of metal for microconnections
[ Development of contact metallizations for connection systems, namely, new product development for others regarding contact metallization; development of connection systems for manufacturing microconnections, namely, development of new technology for others in the field of computer systems for microconnection manufacturing; technology consulting services, in particular with regard to manufacturing microconnections, namely, consulting services in the field of designing of machines for manufacturing microconnections and in the field of development of new technology regarding microconnection manufacturing and applicability ]
Material treatment of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates
Mechanical apparatuses, in particular automatic machines, with regard to microperipheric technologies, namely, semiconductor wafer processing machines; mechanical apparatuses, in particular automatic machines, for the application of connecting materials on substrates; mechanical apparatuses, in particular automatic machines, for manufacturing microconnections, in particular for the production of substrate units from one or more substrates joined as one module, in particular chips
