NEXTREME THERMAL SOLUTIONS
DEAD

Serial Number

77084719

Owner

Nextreme Thermal Solutions, Inc.

Attorney

JOHN M. FUSCOE

First Use Date

Jan 31, 2005

Filing Date

Jan 17, 2007

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NEXTREME THERMAL SOLUTIONS Trademark

Serial Number: 77084719

NEXTREME THERMAL SOLUTIONS is a trademark filed by Nextreme Thermal Solutions, Inc. on January 17, 2007. The trademark is classified under Class 9 (Computers & Electronics), Class 40 (Treatment & Processing), Class 42 (Computer & Scientific). The application is currently no longer active.

Owner Contact Info

Nextreme Thermal Solutions, Inc.

3040 Cornwallis Road
Research Triangle Park, NC 27709

Entity Type: 03

Trademark Details

Filing Date

January 17, 2007

Registration Date

Not Registered

First Use Anywhere

January 31, 2005

First Use in Commerce

January 31, 2005

Goods & Services

Custom manufacturing for others in the field of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive

Thermal management components and modules, namely conventional thermoelectric modules; thin-film thermoelectric coolers and thermally active copper pillar bumps containing a thin film thermoelectric nanomaterial, for applications in the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal power generation and energy harvesting components and modules, namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, for applications in the semiconductor, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal management components and modules, namely thin-film thermoelectric device namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical biomedical, bio-tech, defense aerospace, and automotive industries; and thermal power generation and energy and harvesting components and modules, namely, thermo electric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries

Providing thermal management solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; and providing thermal power generation and energy harvesting solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries

Filing History

ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Sep 6, 2011 MAB2
ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Sep 6, 2011 ABN2
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Feb 8, 2011 GNRN
NON-FINAL ACTION E-MAILED
Feb 8, 2011 GNRT
NON-FINAL ACTION WRITTEN
Feb 8, 2011 CNRT
SUSPENSION CHECKED - TO ATTORNEY FOR ACTION
Jan 19, 2011 RCCK
REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED
Jul 19, 2010 RCSC
ASSIGNED TO EXAMINER
Jul 8, 2010 DOCK
REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED
Jan 19, 2010 RCSC
REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED
Jul 15, 2009 RCSC
REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED
Jan 15, 2009 RCSC
REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED
Jul 9, 2008 RCSC
ASSIGNED TO LIE
Jul 9, 2008 ALIE
ASSIGNED TO EXAMINER
Feb 15, 2008 DOCK
NOTIFICATION OF LETTER OF SUSPENSION E-MAILED
Jan 9, 2008 GNS3
LETTER OF SUSPENSION E-MAILED
Jan 9, 2008 GNSL
SUSPENSION LETTER WRITTEN
Jan 9, 2008 CNSL
TEAS/EMAIL CORRESPONDENCE ENTERED
Nov 22, 2007 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Nov 21, 2007 CRFA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Nov 21, 2007 TROA
NON-FINAL ACTION E-MAILED
May 22, 2007 GNRT
NON-FINAL ACTION WRITTEN
May 22, 2007 CNRT
ASSIGNED TO EXAMINER
May 6, 2007 DOCK
NOTICE OF PSEUDO MARK MAILED
Jan 23, 2007 MPMK
NEW APPLICATION ENTERED
Jan 22, 2007 NWAP