Serial Number
77084719
Owner
Nextreme Thermal Solutions, Inc.Attorney
JOHN M. FUSCOEFirst Use Date
Jan 31, 2005
Filing Date
Jan 17, 2007
NEXTREME THERMAL SOLUTIONS Trademark
Serial Number: 77084719
Trademark Classes
Class 9 - Computers & Electronics
Scientific, nautical, surveying, photographic, cinematographic, optical apparatus and instruments
Class 40 - Treatment & Processing
Treatment of materials
Class 42 - Computer & Scientific
Scientific and technological services; industrial analysis and research services
Owner Contact Info
3040 Cornwallis Road
Research Triangle Park, NC 27709
Entity Type: 03
Legal Representation
Trademark Details
Filing Date
January 17, 2007
Registration Date
Not Registered
First Use Anywhere
January 31, 2005
First Use in Commerce
January 31, 2005
Goods & Services
Custom manufacturing for others in the field of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive
Thermal management components and modules, namely conventional thermoelectric modules; thin-film thermoelectric coolers and thermally active copper pillar bumps containing a thin film thermoelectric nanomaterial, for applications in the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal power generation and energy harvesting components and modules, namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, for applications in the semiconductor, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal management components and modules, namely thin-film thermoelectric device namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical biomedical, bio-tech, defense aerospace, and automotive industries; and thermal power generation and energy and harvesting components and modules, namely, thermo electric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries
Providing thermal management solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; and providing thermal power generation and energy harvesting solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries