MULTI-DIE-INTEGRATION ALLIANCE
LIVE

Serial Number

98088753

Owner

Samsung Electronics Co., Ltd.

Attorney

Diane J. Mason

Filing Date

Jul 17, 2023

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MULTI-DIE-INTEGRATION ALLIANCE Trademark

Serial Number: 98088753 • Registration: 7546390

MULTI-DIE-INTEGRATION ALLIANCE is a trademark filed by Samsung Electronics Co., Ltd. on July 17, 2023. The trademark is classified under Class 9 (Computers & Electronics), Class 40 (Treatment & Processing), Class 42 (Computer & Scientific). The application is currently registered and active.

Owner Contact Info

Samsung Electronics Co., Ltd. (3,467 trademarks)

Suwon City, Kyung Ki Do , KR

Entity Type: 03

Trademark Details

Filing Date

July 17, 2023

Registration Date

October 22, 2024

Goods & Services

Semiconductor foundry services being metal casting for semiconductors; semiconductor foundry services being the custom manufacture of semiconductor wafers; processing of semiconductors being the custom manufacture of semiconductors; custom manufacturing and assembling services relating to semi-conductor parts and integrated circuits; semiconductor and integrated circuit foundry services, namely, custom manufacture of semiconductors and integrated circuits; custom manufacturing services in the nature of processing of integrated circuits being the custom manufacture of integrated circuits; custom manufacturing services in the nature of processing of semiconductor elements being the custom manufacture of semiconductor components; custom manufacturing services in the nature of processing of semiconductor wafers being the custom manufacture of semiconductor wafers; custom manufacture of semiconductor wafers; processing of semiconductor equipment and parts being the custom manufacture of semiconductor components; processing and assembly of semiconductors being the custom manufacture of semiconductors; processing of parts for semiconductor manufacturing being the custom manufacture of semiconductor; custom assembling of circuit board and semiconductor

Semiconductors; optical semiconductors; semiconductor devices; semiconductor component, namely, chips and lead frames; semiconductor components, namely, transistors and diodes; semiconductor component, namely, semiconductor chips; semiconductor components, namely, luminous element packages; semiconductor elements, namely, chips and lead frames; semiconductor elements, namely, wafers, chips, substrates, optical amplifiers, testing apparatus, power elements, chip housings; semiconductor wafers; electronic semiconductors; integrated circuits; chips, namely, integrated circuits; wafers for integrated circuits; solid state drives; semiconductor memories

Design of semiconductors; design of semiconductors and integrated circuits; product research, custom design and testing for new product development in the field of semiconductors; technical research in the field of semiconductor design; technical research in the field of semiconductor manufacturing; design of semiconductor chips; quality control services by tracking of semiconductor devices

Filing History

NOTICE OF REGISTRATION CONFIRMATION EMAILED
Oct 22, 2024 NRCS
REGISTERED-SUPPLEMENTAL REGISTER
Oct 22, 2024 R.SR
APPROVED FOR REGISTRATION SUPPLEMENTAL REGISTER
Sep 18, 2024 CNTA
TEAS/EMAIL CORRESPONDENCE ENTERED
Sep 17, 2024 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Sep 17, 2024 CRFA
ASSIGNED TO LIE
Sep 17, 2024 ALIE
TEAS RESPONSE TO OFFICE ACTION RECEIVED
May 2, 2024 TROA
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Mar 22, 2024 GNRN
NON-FINAL ACTION E-MAILED
Mar 22, 2024 GNRT
NON-FINAL ACTION WRITTEN
Mar 22, 2024 CNRT
ASSIGNED TO EXAMINER
Mar 21, 2024 DOCK
TEAS VOLUNTARY AMENDMENT RECEIVED
Jan 6, 2024 PARI
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Aug 16, 2023 NWOS
NEW APPLICATION ENTERED
Jul 20, 2023 NWAP