MOLDITE
DEAD

Serial Number

78555614

Owner

Moldite, Inc.

Attorney

Michael S. Leonard

First Use Date

Jan 7, 2004

Filing Date

Jan 28, 2005

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MOLDITE Trademark

Serial Number: 78555614

MOLDITE is a trademark filed by Moldite, Inc. on January 28, 2005. The trademark is classified under Class 1 (Chemicals), Class 40 (Treatment & Processing), Class 17 (Rubber Goods). The application is currently no longer active.

Owner Contact Info

Moldite, Inc. (3 trademarks)

40000 Grand River Avenue Suite 103
Novi, MI 48375

Entity Type: 03

Trademark Details

Filing Date

January 28, 2005

Registration Date

Not Registered

First Use Anywhere

January 7, 2004

First Use in Commerce

January 7, 2004

Goods & Services

Polymeric materials with high loading of microparticles or microspheres; resins and plastics, including epoxies, polyesters, vinyl esters, phenolics, thermoplastics, thermosets, polyurethanes, glues, cements, matrix material binders and combinations and hybrids thereof, with a high load of microparticles, including microspheres, ceramic particles, glass particles, plastic particles and combinations thereof; composite materials having high loading of microspheres; molded products of polymeric materials having high loading of microspheres; multi-layered molded products having polymeric materials and high loading of microspheres; cured, semi-cured and uncured polymeric materials with high loading of microparticles; and processing of polymeric materials with high loading of microparticles and manufacturing of related products

Polymeric materials with high loading of microparticles or microspheres; resins and plastics, including epoxies, polyesters, vinyl esters, phenolics, thermoplastics, thermosets, polyurethanes, glues, cements, matrix material binders and combinations and hybrids thereof, with a high load of microparticles, including microspheres, ceramic particles, glass particles, plastic particles and combinations thereof; composite materials having high loading of microspheres; molded products of polymeric materials having high loading of microspheres; multi-layered molded products having polymeric materials and high loading of microspheres; cured, semi-cured and uncured polymeric materials with high loading of microparticles; and processing of polymeric materials with high loading of microparticles and manufacturing of related products

Polymeric materials with high loading of microparticles or microspheres; resins and plastics, including epoxies, polyesters, vinyl esters, phenolics, thermoplastics, thermosets, polyurethanes, glues, cements, matrix material binders and combinations and hybrids thereof, with a high load of microparticles, including microspheres, ceramic particles, glass particles, plastic particles and combinations thereof; composite materials having high loading of microspheres; molded products of polymeric materials having high loading of microspheres; multi-layered molded products having polymeric materials and high loading of microspheres; cured, semi-cured and uncured polymeric materials with high loading of microparticles; and processing of polymeric materials with high loading of microparticles and manufacturing of related products

Filing History

ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Apr 14, 2006 MAB2
ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Apr 13, 2006 ABN2
NON-FINAL ACTION MAILED
Sep 6, 2005 CNRT
NON-FINAL ACTION WRITTEN
Sep 5, 2005 CNRT
ASSIGNED TO EXAMINER
Aug 27, 2005 DOCK
NEW APPLICATION ENTERED
Feb 7, 2005 NWAP