Μ - MATERIAL MACHINE
LIVE

Serial Number

98761636

Owner

SHIN-ETSU CHEMICAL CO., LTD.

Attorney

Danielle I. Mattessich

Filing Date

Sep 20, 2024

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Μ - MATERIAL MACHINE Trademark

Serial Number: 98761636

Μ - MATERIAL MACHINE is a trademark filed by SHIN-ETSU CHEMICAL CO., LTD. on September 20, 2024. The trademark is classified under Class 7 (Machinery). The application is currently pending registration.

Owner Contact Info

SHIN-ETSU CHEMICAL CO., LTD. (67 trademarks)

CHIYODA-KU, TOKYO 100-0004 , JP

Entity Type: 99

Trademark Details

Filing Date

September 20, 2024

Registration Date

Not Registered

Goods & Services

Automatic electronic component mounting machines, namely, machines for automatically mounting IC chips or other electronic components to printed wired boards, and parts and accessories thereof; machines for mounting IC chips to circuit boards, and parts and accessories thereof; LED wafer processing equipment, and parts and accessories thereof; LED wafer treatment equipment, and parts and accessories thereof; LED chip transferring machines, and parts and accessories thereof; machines for automatically mounting LED chips to printed wired boards, and parts and accessories thereof; machines for mounting LED chips to circuit boards, and parts and accessories thereof; stamps and plates for use in manufacturing LED chips; LED chip manufacturing machines, and parts and accessories thereof; LED manufacturing machines, and parts and accessories thereof; wafer processing machines, and parts and accessories thereof; wafer treatment machines, and parts and accessories thereof; laser processing machines and apparatus for glass processing, and parts and accessories thereof; glass processing machines and apparatus, and parts and accessories thereof; glassware manufacturing machines and apparatus; laser processing machines and apparatus for ceramic, and parts and accessories thereof; ceramic processing machines and apparatus, and parts and accessories thereof; chip transferring machines, and parts and accessories thereof; automatic electronic component mounting machines, namely, machines for automatically mounting chips to printed wired boards, and parts and accessories thereof; machines for mounting chips to circuit boards, and parts and accessories thereof; stamps and plates for use in manufacturing chips; chip manufacturing machines, and parts and accessories thereof; display manufacturing machines, and parts and accessories thereof; controllers for display manufacturing machines, and parts and accessories thereof; debonders, and parts and accessories thereof; plastic processing machines and apparatus, and parts and accessories thereof; laser processing machines for plastic processing, and parts and accessories thereof; exposure apparatus for use in display manufacturing, and parts and accessories thereof; laser processing machines for printed circuit board manufacturing, and parts and accessories thereof; processing machines for printed circuit board manufacturing, and parts and accessories thereof; bonders, and parts and accessories thereof; mass transfer equipment, and parts and accessories thereof; memory chip manufacturing machines, and parts and accessories thereof; lift equipment, and parts and accessories thereof; laser lift off equipment, and parts and accessories thereof; semiconductor manufacturing machines with laser, and parts and accessories thereof; printed circuit board manufacturing machines with laser, and parts and accessories thereof; device for marking objects with laser beam; laser welding machines; machines for debonding electronic components from boards by laser irradiating laminated components, and parts and accessories thereof; metalworking machines and tools, and parts and accessories thereof; laser processing machines for metalworking, and parts and accessories thereof; laminated semiconductor chip manufacturing machines, and parts and accessories thereof; electronic components feeding devices for use in manufacturing electronic circuit boards, and parts and accessories thereof; stamps and plates for use in manufacturing electronic components and micro computer chips; electronic components manufacturing machines, and parts and accessories thereof; semiconductor wafer processing equipment, and parts and accessories thereof; semiconductor wafer treatment equipment, and parts and accessories thereof; semiconductor chip transferring machines, and parts and accessories thereof; semiconductor substrate manufacturing machines, and parts and accessories thereof; jigs for semiconductor substrate, and parts and accessories thereof; jigs for boards of semiconductor manufacturing machines, and parts and accessories thereof; semiconductor manufacturing machines, and parts and accessories thereof; processing machines for semiconductor manufacturing, and parts and accessories thereof; laser processing machines for semiconductor manufacturing, and parts and accessories thereof; semiconductor manufacturing machines and apparatus, and parts and accessories thereof; thermal treating equipment for semiconductor manufacturing, and parts and accessories thereof; components mounting machines for semiconductor manufacturing, and parts and accessories thereof

Filing History

SUSPENSION CHECKED - TO ATTORNEY FOR ACTION
Oct 17, 2025 RCCK
NOTIFICATION OF LETTER OF SUSPENSION E-MAILED
Apr 16, 2025 GNS3
LETTER OF SUSPENSION E-MAILED
Apr 16, 2025 GNSL
SUSPENSION LETTER WRITTEN
Apr 16, 2025 CNSL
ASSIGNED TO EXAMINER
Mar 28, 2025 DOCK
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Mar 27, 2025 NWOS
NEW APPLICATION ENTERED
Sep 20, 2024 NWAP