LIGHTIUM Trademark

Testing, characterization, sorting and validation of high-frequency photonic integrated circuits; measurement of optical, electrical and thermal performance of photonic devices; calibration, qualification and analysis of the reliability of photonic components, including encapsulated modules and chiplets; metrological inspection of photonic chips; on-demand testing services for photonic integrated circuits for industrial or scientific applications; development, maintenance and provision of process design kits (PDKs) for photonic integrated circuits; technical support services, namely design, simulation and verification of photonic components using PDKs; PDK adaptation services for specific platforms or processes; scientific and technological services; engineering services relating to information technologies and in the field of communications technology; technological consultancy services; telecommunication technology consultancy services; research in the fields of telecommunications technology, information technology and artificial intelligence technology; information technology engineering; design and development of information and communication technology; scientific and technological services as well as research and design services relating thereto; industrial analysis, industrial research and industrial design services; quality control and authentication services; design and development of computers and software; design and development of chips, photonic chips, silicon chips, integrated circuits and wafers for integrated circuits; quality control of integrated photonic devices; testing of photonic circuits during production; end-of-line optical and electrical characterization services for high-frequency photonic circuits.

Photonic integrated circuits (PICs); photonic computer chips; integrated photonic chips for use in artificial intelligence (AI) applications; chiplets compriisng one or more integrated photonic chips; photonic chipsets; low-consumption, high-speed and high-optical-efficiency photonic electro-optic on-insulator devices; encapsulated electro-optic modulators incorporating photonic chips; photonics-specialized computer hardware; photonic components for telecommunications, quantum photonics and data processing; thin-film lithium niobate (TFLN) integrated circuits; high-performance opto-electronic devices; photonic interposers and hybrid integration solutions; downloadable process design kits (PDKs) for photonic integrated circuits; software libraries and simulation models for the design of photonic circuits; software for the design, verification and installation of photonic components; optical receivers; fiber-optic connections; semiconductor chips; semiconductor optical amplifiers; semiconductor devices; optical frequency metrology devices; semi-conductors; scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signaling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity distribution or use; apparatus and instruments for sound, image or data recording, transmission, reproduction or processing; recorded and downloadable media, computer software, blank digital or analogue recording and storage media; chips (integrated circuits); computer chips; microchips; electronic circuits; integrated circuits; electronic components for integrated circuit cards; downloadable process design kit (PDK) libraries for photonic integrated circuits.

Services for the fabrication of high-frequency photonic integrated circuits, especially thin-film lithium niobate (TFLN) substrates; heterogeneous integration of active and passive components (such as lasers, detectors, modulators) on photonic chips, including via micro-transfer, bonding or hybrid assembly techniques; fabrication of chips, photonic chips, integrated circuits, wafers for integrated circuits, chiplets, chipsets, and opto-electronic components; encapsulation and interconnection of photonic devices; sorting of photonic circuits during production.