Serial Number
78726132
Owner
NGK SPARK PLUG CO., LTD.Attorney
Mainak H. MehtaFirst Use Date
Jul 14, 2008
Filing Date
Oct 4, 2005
LICOP Trademark
Serial Number: 78726132 • Registration: 3509964
Trademark Classes
Owner Contact Info
Legal Representation
Trademark Details
Filing Date
October 4, 2005
Registration Date
September 30, 2008
First Use Anywhere
July 14, 2008
First Use in Commerce
July 14, 2008
Published for Opposition
November 14, 2006
Cancellation Date
May 3, 2019
Goods & Services
Integrated circuit packages for semi-conductors, namely, semiconductor chip housings; semiconductor chip packages containing semiconductor chip housings and semiconductor chips; packages for crystal resonator or SAW, Surface Acoustic Wave, filter, namely, protective housings for crystal resonator or SAW Surface Acoustic Wave, filter; leadless chip carriers, namely semiconductor chip housings; semiconductor devices, namely interposers for semiconductors, namely, connectors for semiconductors; printed wiring boards for semi-conductors; integrated circuit packages for semi-conductors, namely, pin grid array chip packages consisting of supporting boards on which pins are gridded array; integrated circuit packages for semi-conductors, namely, ball grid array chip packages consisting of supporting boards on which balls are gridded array; integrated circuit packages for semi-conductors, namely, flat packages consisting of housings for integrated circuits; integrated circuit packages for semi-conductors, namely, packages consisting of supporting boards and housings for integrated circuits for high frequency band; aluminum nitride products, namely, ceramic integrated circuit packages consisting of ceramic housings and supporting boards used in the manufacture of CPUs, Central Processing Units, or MPUs, Micro Processor Units; integrated circuit packages for semi-conductors, namely, ceramic packages consisting of ceramic housings and supporting boards used in the manufacture of CPUs, Central Processing Units, or MPUs, Micro Processor Units; electric wires, namely printed wiring; printed circuit boards, namely, multilayer circuit boards; substrates for semi-conductors, namely, supporting boards on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached or in which electronic devices including integrated circuits, chip condensers and chip capacitors are embedded; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached; multi-chip module substrates, namely, supporting boards on which integrated circuits, chip condensers, chip capacitors, chip resistors and chip inductors are installed; glazed substrates for thermal printer heads, namely, supporting boards which are attached in thermal printer heads
