TrademarkDir
IDI COMPOSITES INTERNATIONAL THERMOSET MOLDING COMPOUNDS
DEAD

Serial Number

77160405

Owner

Industrial Dielectrics Incorporated

Attorney

John S. Terry

First Use Date

Jun 21, 2006

Filing Date

Apr 19, 2007

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IDI COMPOSITES INTERNATIONAL THERMOSET MOLDING COMPOUNDS Trademark

Serial Number: 77160405 • Registration: 3371857

IDI COMPOSITES INTERNATIONAL THERMOSET MOLDING COMPOUNDS is a trademark filed by Industrial Dielectrics Incorporated on April 19, 2007. The trademark is classified under Class 1 (Chemicals). The application is currently no longer active.

Owner Contact Info

Industrial Dielectrics Incorporated

407 South 7th Street, P.O. Box 357
Noblesville, IN 46061

Entity Type: 03

Trademark Details

Filing Date

April 19, 2007

Registration Date

January 22, 2008

First Use Anywhere

June 21, 2006

First Use in Commerce

June 21, 2006

Published for Opposition

November 6, 2007

Cancellation Date

August 29, 2014

Goods & Services

Plastic molding compounds for use in the manufacture of molded plastic articles

Filing History

CANCELLED SEC. 8 (6-YR)
Aug 29, 2014 C8..
REGISTERED-PRINCIPAL REGISTER
Jan 22, 2008 R.PR
PUBLISHED FOR OPPOSITION
Nov 6, 2007 PUBO
NOTICE OF PUBLICATION
Oct 17, 2007 NPUB
LAW OFFICE PUBLICATION REVIEW COMPLETED
Sep 28, 2007 PREV
ASSIGNED TO LIE
Sep 28, 2007 ALIE
APPROVED FOR PUB - PRINCIPAL REGISTER
Aug 28, 2007 CNSA
EXAMINER'S AMENDMENT ENTERED
Aug 28, 2007 XAEC
NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Aug 28, 2007 GNEN
EXAMINERS AMENDMENT E-MAILED
Aug 28, 2007 GNEA
EXAMINERS AMENDMENT -WRITTEN
Aug 28, 2007 CNEA
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Aug 9, 2007 GNRN
NON-FINAL ACTION E-MAILED
Aug 9, 2007 GNRT
NON-FINAL ACTION WRITTEN
Aug 9, 2007 CNRT
ASSIGNED TO EXAMINER
Aug 2, 2007 DOCK
NOTICE OF DESIGN SEARCH CODE MAILED
Apr 28, 2007 MDSC
NEW APPLICATION ENTERED
Apr 27, 2007 NWAP

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