HY-BOND
DEAD
Serial Number
76556100
Owner
SHOFU, INC.Attorney
YOSHIO KATAYAMAFirst Use Date
Feb 4, 1987
Filing Date
Oct 16, 2003
HY-BOND Trademark
Serial Number: 76556100
HY-BOND is a trademark filed by
SHOFU, INC.
on October 16, 2003. The trademark is classified under Class 5 (Pharmaceuticals).
The application is currently no longer active.
Trademark Classes
Owner Contact Info
Legal Representation
Trademark Details
Filing Date
October 16, 2003
Registration Date
Not Registered
First Use Anywhere
February 4, 1987
First Use in Commerce
February 4, 1987
Goods & Services
Dental Material-namely, Dental Cement for Bonding Purposes
Filing History
ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Dec 30, 2004 MAB2
ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Dec 30, 2004 ABN2
ASSIGNED TO EXAMINER
Dec 23, 2004 DOCK
NON-FINAL ACTION MAILED
May 3, 2004 CNRT
ASSIGNED TO EXAMINER
May 2, 2004 DOCK
NEW APPLICATION ENTERED
Nov 19, 2003 NWAP
