HY-BOND
DEAD

Serial Number

74425256

Owner

SHOFU, INC.

Attorney

YOSHIO KATAYAMA

First Use Date

Feb 4, 1987

Filing Date

Aug 16, 1993

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HY-BOND Trademark

Serial Number: 74425256 • Registration: 1840278

HY-BOND is a trademark filed by SHOFU, INC. on August 16, 1993. The trademark is classified under Class 5 (Pharmaceuticals). The application is currently no longer active.

Owner Contact Info

SHOFU, INC. (65 trademarks)

11 KAMITAKAMATSU-CHO, FUKUINE
KYOTO 605 , JP

Entity Type: 03

Trademark Details

Filing Date

August 16, 1993

Registration Date

June 21, 1994

First Use Anywhere

February 4, 1987

First Use in Commerce

February 4, 1987

Published for Opposition

March 29, 1994

Cancellation Date

March 26, 2005

Goods & Services

dental cement for bonding purposes

Filing History

CANCELLED SEC. 8 (10-YR)/EXPIRED SECTION 9
Mar 26, 2005 CAEX
REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Dec 30, 1999 C15A
REGISTERED - SEC. 8 (6-YR) & SEC. 15 FILED
Sep 15, 1999 815F
REGISTERED-PRINCIPAL REGISTER
Jun 21, 1994 R.PR
PUBLISHED FOR OPPOSITION
Mar 29, 1994 PUBO
NOTICE OF PUBLICATION
Feb 25, 1994 NPUB
APPROVED FOR PUB - PRINCIPAL REGISTER
Jan 26, 1994 CNSA
EXAMINER'S AMENDMENT MAILED
Jan 18, 1994 CNEA
ASSIGNED TO EXAMINER
Dec 7, 1993 DOCK