HIGH DENSITY VIA PATTERN (HDVP)
DEAD
Serial Number
88771443
Owner
TTM Technologies, Inc.Attorney
Elton F. Dean, IIIFiling Date
Jan 23, 2020
HIGH DENSITY VIA PATTERN (HDVP) Trademark
Serial Number: 88771443
HIGH DENSITY VIA PATTERN (HDVP) is a trademark filed by
TTM Technologies, Inc.
on January 23, 2020. The trademark is classified under Class 9 (Computers & Electronics), Class 40 (Treatment & Processing).
The application is currently no longer active.
Trademark Classes
Owner Contact Info
Legal Representation
Correspondence Address
Elton F. Dean, III POLSINELLI PC
100 S. FOURTH STREET
SUITE 1000
ST. LOUIS
MO 63102
Trademark Details
Filing Date
January 23, 2020
Registration Date
Not Registered
Filing History
ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND
Nov 1, 2021 MAB2
ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Nov 1, 2021 MAB2
ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Nov 1, 2021 ABN2
ASSIGNED TO EXAMINER
Sep 14, 2021 DOCK
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Apr 19, 2021 GNRN
NON-FINAL ACTION E-MAILED
Apr 19, 2021 GNRT
NON-FINAL ACTION WRITTEN
Apr 19, 2021 CNRT
TEAS/EMAIL CORRESPONDENCE ENTERED
Feb 5, 2021 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Feb 5, 2021 CRFA
ASSIGNED TO LIE
Feb 3, 2021 ALIE
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Oct 28, 2020 TROA
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Apr 28, 2020 GNRN
NON-FINAL ACTION E-MAILED
Apr 28, 2020 GNRT
NON-FINAL ACTION WRITTEN
Apr 28, 2020 CNRT
ASSIGNED TO EXAMINER
Apr 11, 2020 DOCK
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Jan 28, 2020 NWOS
NEW APPLICATION ENTERED
Jan 27, 2020 NWAP
