Serial Number
97376157
Owner
Shin-Etsu Engineering Co., Ltd.Attorney
Anna Kurian ShawFiling Date
Apr 22, 2022
GAP-LLO Trademark
Serial Number: 97376157 • Registration: 7910622
Trademark Classes
Owner Contact Info
9, Kanda-nishiki-cho 2-chome, Chiyoda-ku
Tokyo 101-0054 , JP
Entity Type: 03
Legal Representation
Correspondence Address
Anna Kurian Shaw HOGAN LOVELLS US LLP
555 13TH STREET NW
WASHINGTON, DC 20004
United States
Trademark Details
Filing Date
April 22, 2022
Registration Date
August 26, 2025
Published for Opposition
June 10, 2025
Goods & Services
Semiconductor substrates manufacturing machines; semiconductor manufacturing machines; electronic component feeder machines for processing electronic components of electronic circuits used in electronic circuit board manufacturing machines; machines for manufacturing electronic parts; mounting machines specifically adapted for mounting electronic components of light-emitting diodes (LEDs) during the manufacturing of semiconductor devices; power operated automatic mounting machines that automatically mount electronic parts, namely, integrated circuit chips, to printed wiring circuit boards; manufacturing machines for memory chips; manufacturing machines for laminated semiconductor chips; power operated machines that mount integrated circuit chips to circuit boards; transfer machines for semiconductor chips, namely, machines specifically adapted for transferring electronic components of light-emitting diodes (LEDs) from one substrate to another via laser beam; processing equipment for semiconductor wafer; laser processing machines for processing glass pieces; laser processing machines for processing plastics; laser processing machines for processing ceramics; laser processing machines for processing printed circuit boards; machines for processing printed circuit boards; laser processing machines for processing circuits or chips as parts of semi-conductors; semiconductor and printed circuit board manufacturing machines using laser; machines for peeling electronic components from substrate boards by irradiating the electronic components laminated on the substrate with laser; substrate restraining jig for semiconductor manufacturing machines; laser lift-off machines used for stripping chip parts; manufacturing equipment and machines used for the production of micro-LED displays; replacement parts for all of the aforementioned goods
