Serial Number
85973009
Owner
GLOBALFOUNDRIES INC.Attorney
Belinda J. ScrimentiFirst Use Date
Dec 12, 2012
Filing Date
Jun 28, 2013
FOUNDRY 2.0 Trademark
Serial Number: 85973009 • Registration: 4591366
Trademark Classes
Owner Contact Info
MAPLES CORPORATE SERVICES LTD, UGLAND
GRAND CAYMAN KY1-1104 , KY
Entity Type: 99
Legal Representation
Trademark Details
Filing Date
June 28, 2013
Registration Date
August 26, 2014
First Use Anywhere
December 12, 2012
First Use in Commerce
December 12, 2012
Published for Opposition
June 10, 2014
Cancellation Date
April 2, 2021
Goods & Services
Custom manufacture of semiconductors and integrated circuits; manufacturing consultation services in the field of semiconductor fabrication; custom manufacturing consultation services in the field of semiconductor and integrated circuit manufacture, namely, manufacture of semiconductor systems and architectures, system-on-chip integration, semiconductor process and manufacturing design, and testing, packaging, and assembly relating to the manufacture of semiconductors and integrated circuits
Custom design, engineering and testing for new product development of semiconductors and integrated circuits; technology consultation services regarding semiconductors and integrated circuits; technical consulting services in the field of semiconductor fabrication and development; computer software and hardware testing services, namely, testing of computer software on computers and servers in the field of semiconductor manufacturing technology for production of a uniquely designed semiconductor; installation, updating and maintenance of computer software in the field of semiconductor manufacturing technology for production of a uniquely designed semiconductor; computer programming for others in the field of semiconductor manufacturing technology for production of a uniquely designed semiconductor; technological consultation for customers and suppliers in the technology field of semiconductors and integrated circuits, namely, semiconductor systems and architectures, system-on-chip integration, semiconductor process and manufacturing design, and testing, packaging, and assembly relating to semiconductors and integrated circuits