Serial Number
85837492
Owner
ALPHA ASSEMBLY SOLUTIONS INC.Attorney
Arthur G. SchaierFiling Date
Jan 31, 2013
FORTIBOND Trademark
Serial Number: 85837492
Trademark Classes
Class 1 - Chemicals
Chemical products for industry, science, photography, agriculture, horticulture and forestry
Class 2 - Paints
Paints, varnishes, lacquers; preservatives against rust and against deterioration of wood
Class 17 - Rubber Goods
Unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica
Owner Contact Info
245 FREIGHT STREET
WATERBURY, CT 06702
Entity Type: 03
109 CORPORATE BOULEVARD
SOUTH PLAINFIELD, NJ 07080
Entity Type: 03
Legal Representation
Trademark Details
Filing Date
January 31, 2013
Registration Date
Not Registered
Published for Opposition
November 10, 2015
Goods & Services
Printable or dispensable or jettable inks composed of silver powder mixed with epoxy material all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device; pastes for reflective layer printing or transfer composed of silver powder mixed with epoxy material
Transferable semi-finished films for wafer-to-wafer bonding, attachment of semiconductor die either flip chip or wire bonded, onto a variety of substrates, and hermetic/near hermetic packaging; semi-finished films for reflective layer printing or transfer; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device
Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer bumping or wire bonded type, onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes for production of electrical and thermal interconnect lines and patterns circuitry, pads; Printable pastes for via-fill applications; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device
