Serial Number
97062724
Owner
eYs3D Microelectronics, Co.Attorney
Paulo A. de AlmeidaFiling Date
Oct 6, 2021
ECAPTURE Trademark
Serial Number: 97062724
Trademark Classes
Owner Contact Info
Legal Representation
Trademark Details
Filing Date
October 6, 2021
Registration Date
Not Registered
Goods & Services
Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality), AR (Augmented Reality) and MR(Mixed Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus; Software and electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Chipsets; Semiconductor chip sets; Microchips (computer hardware); Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits; IC; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer hardware; computer components; computer circuits; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Electric and electronic circuits; Wafers for integrated circuits; Integrated circuit cards and components; Integrated circuit module; Semiconductors; Semiconductor devices; Semiconductor wafers; chip sets, and modules for 3D sensing, 3D sensor fusion and 3D perception