DI PAK THE FUTURE OF CERAMIC PACKAGING
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DI PAK THE FUTURE OF CERAMIC PACKAGING Trademark

Serial Number: 75370818

DI PAK THE FUTURE OF CERAMIC PACKAGING is a trademark filed by DIELECTRIC LABORATORIES, INC. on October 9, 1997. The trademark is classified under Class 9 (Computers & Electronics). The application is currently no longer active.

Owner Contact Info

DIELECTRIC LABORATORIES, INC. (27 trademarks)

2777 ROUTE 20 EAST
CAZENOVIA, NY 13035

Entity Type: 03

Trademark Details

Filing Date

October 9, 1997

Registration Date

Not Registered

Published for Opposition

November 30, 1999

Goods & Services

Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof

Filing History

ABANDONMENT - NO USE STATEMENT FILED
Nov 17, 2000 ABN6
NOA MAILED - SOU REQUIRED FROM APPLICANT
Feb 22, 2000 NOAM
PUBLISHED FOR OPPOSITION
Nov 30, 1999 PUBO
NOTICE OF PUBLICATION
Oct 29, 1999 NPUB
APPROVED FOR PUB - PRINCIPAL REGISTER
Aug 4, 1999 CNSA
EXAMINER'S AMENDMENT MAILED
Jul 14, 1999 CNEA
NON-FINAL ACTION MAILED
Mar 5, 1999 CNRT
NON-FINAL ACTION MAILED
Jan 25, 1999 CNRT
CORRESPONDENCE RECEIVED IN LAW OFFICE
Nov 27, 1998 CRFA
NON-FINAL ACTION MAILED
Jun 19, 1998 CNRT
ASSIGNED TO EXAMINER
Jun 17, 1998 DOCK
ASSIGNED TO EXAMINER
Jun 4, 1998 DOCK