CUPRIMA Trademark

Adhesives for use in the manufacture of electronic components; tacking agent [temporary fixing adhesives]; tacking agent, namely, temporary fixing adhesives for industrial use; temporary fixing adhesives used for electronic components; temporary fixing adhesives for use in the manufacture of semiconductors; temporary fixing adhesives used for temporary binding semiconductor chips in assembly processes of electronic components and semiconductors

Powder of copper in the form of pastes used in bonding and sintering processes of electronic components; copper preforms used in bonding and sintering processes of electronic components; semi-processed copper used in bonding and sintering processes of electronic components; powder of copper in the form of pastes used as a bonding material for electronic components such as power semiconductors; copper preforms used as a bonding material for electronic components such as power semiconductors; semi-processed copper used as a bonding material for electronic components such as power semiconductors; copper and its alloys in the form of pastes used for sintering in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for die attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of sheets used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; preforms of copper and copper alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; semi-processed copper and its alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for die attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates on printed circuit boards in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in manufacturing processes of electronic components such as power semiconductors; powder of copper in the form of pastes used for sinter joining