CMPLICITY
DEAD

Add to watchlist:

No watchlists yet
View on USPTO

CMPLICITY Trademark

Serial Number: 77175261

CMPLICITY is a trademark filed by ADVANCED TECHNOLOGY MATERIALS, INC. on May 8, 2007. The trademark is classified under Class 1 (Chemicals), Class 3 (Cosmetics & Cleaning), Class 6 (Metal Goods), Class 7 (Machinery), Class 9 (Computers & Electronics), Class 20 (Furniture). The application is currently no longer active.

Owner Contact Info

ADVANCED TECHNOLOGY MATERIALS, INC. (75 trademarks)

DANBURY, CT 06810

Entity Type: 03

Trademark Details

Filing Date

May 8, 2007

Registration Date

Not Registered

Published for Opposition

September 2, 2008

Goods & Services

Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, dispensers for delivering metered or measured amounts of chemical mechanical polishing and planarization compositions and post-chemical mechanical polishing and planarization cleaning compositions to machines performing chemical mechanical polishing and planarization processes and machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products

Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, mixing machines for blending, mixing and delivering chemicals and chemical mechanical polishing and planarization compositions to machines performing chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products; and mixing machines for blending, mixing, and delivering chemicals and post-chemical mechanical polishing and planarization cleaning compositions to machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products

Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, metal fluid storage tanks for holding chemical mechanical polishing and planarization compositions, and for holding post-chemical mechanical polishing and planarization cleaning compositions, for machines performing chemical mechanical polishing and planarization processes and for machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products

Chemical mechanical polishing and planarization preparations for use in chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products

Chemicals for use in chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products

Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, plastic fluid storage tanks for holding chemical mechanical polishing and planarization compositions, and for holding post-chemical mechanical polishing and planarization cleaning compositions, for machines performing chemical mechanical polishing and planarization processes and for machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products

Filing History

ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED
Dec 28, 2009 MAB6
ABANDONMENT - NO USE STATEMENT FILED
Dec 28, 2009 ABN6
SOU EXTENSION 1 GRANTED
Jun 12, 2009 EX1G
CASE ASSIGNED TO INTENT TO USE PARALEGAL
Jun 12, 2009 AITU
SOU TEAS EXTENSION RECEIVED
May 26, 2009 EEXT
SOU EXTENSION 1 FILED
May 25, 2009 EXT1
NOA MAILED - SOU REQUIRED FROM APPLICANT
Nov 25, 2008 NOAM
PUBLISHED FOR OPPOSITION
Sep 2, 2008 PUBO
NOTICE OF PUBLICATION
Aug 13, 2008 NPUB
LAW OFFICE PUBLICATION REVIEW COMPLETED
Jul 30, 2008 PREV
ASSIGNED TO LIE
Jul 29, 2008 ALIE
APPROVED FOR PUB - PRINCIPAL REGISTER
Jul 29, 2008 CNSA
TEAS/EMAIL CORRESPONDENCE ENTERED
Jul 23, 2008 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Jul 23, 2008 CRFA
TEAS REQUEST FOR RECONSIDERATION RECEIVED
Jul 23, 2008 ERFR
NOTIFICATION OF FINAL REFUSAL EMAILED
Jan 25, 2008 GNFN
FINAL REFUSAL E-MAILED
Jan 25, 2008 GNFR
FINAL REFUSAL WRITTEN
Jan 25, 2008 CNFR
TEAS/EMAIL CORRESPONDENCE ENTERED
Dec 31, 2007 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Dec 30, 2007 CRFA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Dec 30, 2007 TROA
NOTIFICATION OF NON-FINAL ACTION E-MAILED
Jul 5, 2007 GNRN
NON-FINAL ACTION E-MAILED
Jul 5, 2007 GNRT
NON-FINAL ACTION WRITTEN
Jul 5, 2007 CNRT
ASSIGNED TO EXAMINER
Jun 29, 2007 DOCK
NOTICE OF PSEUDO MARK MAILED
May 12, 2007 MPMK
NEW APPLICATION ENTERED
May 11, 2007 NWAP