CELLFIL
LIVE

Serial Number

79313789

Owner

TAIYO HOLDINGS CO., LTD.

Attorney

Kumiko Ide

Filing Date

Feb 22, 2021

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CELLFIL Trademark

Serial Number: 79313789 • Registration: 6741699

CELLFIL is a trademark filed by TAIYO HOLDINGS CO., LTD. on February 22, 2021. The trademark is classified under Class 1 (Chemicals), Class 2 (Paints), Class 17 (Rubber Goods). The application is currently registered and active.

Owner Contact Info

TAIYO HOLDINGS CO., LTD. (45 trademarks)

TOKYO 176-8508 , JP

Entity Type: 03

Trademark Details

Filing Date

February 22, 2021

Registration Date

May 31, 2022

Published for Opposition

March 15, 2022

Goods & Services

Dyes, namely, synthetic dyes; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks being printing inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink

Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry films, namely, mold dry films for electronic components; unexposed dry films, namely, insulation mold dry films for electronic components; unexposed dry films, namely, thermal curing type mold dry films for electronic components; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing electronic components; synthetic resins that are used as sealants for use in the process of producing electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package application boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics

Filing History

NEW REPRESENTATIVE AT IB RECEIVED
Apr 2, 2026 NREP
FINAL DECISION TRANSACTION PROCESSED BY IB
Oct 10, 2022 FINO
FINAL DISPOSITION NOTICE SENT TO IB
Sep 15, 2022 FICS
FINAL DISPOSITION PROCESSED
Sep 15, 2022 FIMP
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
Aug 31, 2022 FICR
CHANGE OF NAME/ADDRESS REC'D FROM IB
Jul 9, 2022 ADCH
NOTICE OF REGISTRATION CONFIRMATION EMAILED
May 31, 2022 NRCC
REGISTERED-PRINCIPAL REGISTER
May 31, 2022 R.PR
NOTIFICATION PROCESSED BY IB
Mar 21, 2022 GPNX
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Mar 15, 2022 NPUB
PUBLISHED FOR OPPOSITION
Mar 15, 2022 PUBO
NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
Feb 23, 2022 OPNS
NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB
Feb 23, 2022 OP2R
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Feb 23, 2022 NONP
TEAS CHANGE OF CORRESPONDENCE RECEIVED
Feb 14, 2022 TCCA
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Feb 14, 2022 ARAA
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Feb 14, 2022 REAP
APPROVED FOR PUB - PRINCIPAL REGISTER
Feb 9, 2022 CNSA
TEAS/EMAIL CORRESPONDENCE ENTERED
Feb 9, 2022 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Feb 9, 2022 CRFA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Feb 9, 2022 TROA
REFUSAL PROCESSED BY IB
Nov 5, 2021 RFNT
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Oct 12, 2021 RFCS
REFUSAL PROCESSED BY MPU
Oct 12, 2021 RFRR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Sep 25, 2021 RFCR
NON-FINAL ACTION WRITTEN
Sep 24, 2021 CNRT
ASSIGNED TO EXAMINER
Sep 16, 2021 DOCK
CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED
Aug 5, 2021 CORR
CORRECTION TRANSACTION RECEIVED FROM IB
Jul 31, 2021 CRCV
APPLICATION FILING RECEIPT MAILED
Jul 6, 2021 MAFR
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Jun 30, 2021 NWOS
LIMITATION FROM ORIGINAL APPLICATION ENTERED
Jun 28, 2021 LIMI
SN ASSIGNED FOR SECT 66A APPL FROM IB
Jun 24, 2021 REPR