CAPRAM
LIVE

Serial Number

79430208

Owner

SEMRON GmbH

Attorney

Daniel M. Gurfinkel

Filing Date

May 16, 2025

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CAPRAM Trademark

Serial Number: 79430208

CAPRAM is a trademark filed by SEMRON GmbH on May 16, 2025. The trademark is classified under Class 1 (Chemicals), Class 9 (Computers & Electronics), Class 40 (Treatment & Processing), Class 42 (Computer & Scientific). The application is currently pending registration.

Owner Contact Info

SEMRON GmbH (2 trademarks)

Frauenstrasse 9

Entity Type: 27

Trademark Details

Filing Date

May 16, 2025

Registration Date

Not Registered

Published for Opposition

July 7, 2026

Goods & Services

Custom manufacturing of computer chips for others; custom manufacturing of integrated circuits for others; custom manufacturing of semiconductor components, devices and circuits for others; custom manufacturing and assembly services for semiconductor components and integrated circuits for others; custom manufacturing of AI hardware for others; semiconductor processing services, namely, ion implantation services, chemical vapor deposition services, physical vapor deposition services, atomic layer deposition services, photolithography services, and chemical mechanical planarization services for the manufacture of semiconductors; treatment and processing of semiconductors, namely, wafer thinning services, through-silicon via etching services, wafer bonding services, annealing services, and dry etching services for the manufacture of three-dimensional integrated circuits.

Semiconductors; semiconductor devices; semiconductor chips; semiconductor power elements; semiconductor memory devices; semiconductor memory units; computer chipsets; integrated circuit chips; chips, namely, integrated circuits; silicon chips in the nature of electronic components; electronic memory chips in the nature of integrated circuits; computer chipsets for transferring data to and from a central processing unit; recorded computer software for developing integrated circuits; recorded software for operating and managing integrated circuit components; integrated circuit memories; electronic memory circuits in the nature of integrated circuits; integrated circuit memory cards; compilers, namely, downloadable compiler software; downloadable artificial intelligence software; downloadable artificial intelligence software for analysis; downloadable machine learning software; downloadable machine learning software for analysis; memory devices, namely, memory cards; memory modules; downloadable artificial intelligence software for vehicles; volatile memory being computer memory devices; non-volatile memory being computer memory devices; flash memory being computer memory devices; computer memory devices; portable computers; portable computer hardware; portable computer peripherals; portable peripherals for computers portable communication devices, namely, portable AI computing modules, wireless edge inference devices, and portable semiconductor processing units for artificial intelligence applications; mobile computers; augmented reality glasses; augmented reality headsets; hardware for augmented reality, namely, augmented reality processors, augmented reality computing modules, semiconductor chips for use in augmented reality headsets, and augmented reality edge inference accelerators; smart glasses; smartphones; smartwatches; smart rings; blank smart cards; virtual reality glasses; virtual reality hardware, namely, virtual reality processors, virtual reality computing modules, semiconductor chips for use in virtual reality headsets, and virtual reality edge inference accelerator; virtual reality headsets; AI computer hardware; AI chips, namely, semiconductor chips.

Integrated circuit design; computer hardware design; computer chip design and development; AI hardware design and development; computer hardware development; electronic circuit design engineering services; semiconductor manufacturing technological consulting; silicon photonics chip manufacturing technological research; semiconductor technology research and development; artificial intelligence technology research and development; artificial intelligence technology research; artificial intelligence technology consulting; provision of computer programs, namely, providing online, non-downloadable software for artificial intelligence in data networks; artificial intelligence technology consulting; edge computing research; semiconductor processing technology research; semiconductor processing technology technical consulting; In-memory computing technology development; Software as a Service (SaaS) featuring software for use in optimizing, quantizing, and compressing artificial intelligence as well as edge computing.

Silicon; semiconductor silicon; chemicals for the manufacture of semiconductors; chemical preparations for the manufacture of electronic components; chemical compositions for the manufacture of computer chips; industrial chemicals for the manufacture of integrated circuits; chemical products for the electronics industry, namely, deposition chemicals, etching chemicals, cleaning chemicals, and surface treatment chemicals for use in flash memory manufacture; chemicals for the manufacture of semiconductor chips; etchants for the manufacture of semiconductors; adhesives for industrial purposes in the form of chips; dopants, namely, boron, phosphorus, arsenic, and antimony, for the manufacture of semiconductors; chemical starting materials, namely silane, tetraethyl orthosilicate, trimethylaluminum, hafnium tetrachloride, and tungsten hexafluoride, for the deposition of thin films on semiconductor wafers for the manufacture of semiconductors; chemical substances, namely silane, tetraethyl orthosilicate, trimethylaluminum, hafnium tetrachloride, and tungsten hexafluoride, for the deposition of thin films on semiconductor wafers for the manufacture of semiconductors.

Filing History

OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Jul 7, 2026 NPUB
PUBLISHED FOR OPPOSITION
Jul 7, 2026 PUBO
NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Jul 1, 2026 NONP
APPROVED FOR PUB - PRINCIPAL REGISTER
Jun 9, 2026 CNSA
TEAS/EMAIL CORRESPONDENCE ENTERED
Jun 9, 2026 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Jun 9, 2026 CRFA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Jun 9, 2026 TROA
LIMITATION OF GOODS RECEIVED FROM IB
May 7, 2026 LIMG
REFUSAL PROCESSED BY IB
Jan 8, 2026 RFNT
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Dec 21, 2025 RFCS
REFUSAL PROCESSED BY MPU
Dec 21, 2025 RFRR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Nov 15, 2025 RFCR
NON-FINAL ACTION WRITTEN
Nov 14, 2025 CNRT
ASSIGNED TO EXAMINER
Sep 29, 2025 DOCK
APPLICATION FILING RECEIPT MAILED
Aug 15, 2025 MAFR
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Aug 15, 2025 NWOS
SN ASSIGNED FOR SECT 66A APPL FROM IB
Aug 14, 2025 REPR