Serial Number
86819727
Owner
The Indium Corporation of AmericaAttorney
James R. MuldoonFirst Use Date
Mar 31, 2016
Filing Date
Nov 13, 2015
AVOID THE VOID Trademark
Serial Number: 86819727 • Registration: 5138675
Trademark Classes
Owner Contact Info
Legal Representation
Correspondence Address
James R. Muldoon HARRIS BEACH MURTHA CULLINA PLLC
333 WEST WASHINGTON STREET
SUITE 200
SYRACUSE, NY 13202
United States
Trademark Details
Filing Date
November 13, 2015
Registration Date
February 7, 2017
First Use Anywhere
March 31, 2016
First Use in Commerce
March 31, 2016
Published for Opposition
April 26, 2016
Goods & Services
Educational services, namely, providing a website featuring blogs and non-downloadable publications in the nature of articles, brochures, and technical papers in the fields of solders, specialty alloys, and electrically-conductive materials; educational services, namely, live and on-line classes, seminars, conferences, meetings, workshops and informal programs using on-line activities and interactive exhibits and printable materials distributed therewith in the field of developing, manufacturing, supplying, and processing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium
Technical consultation in the field of developing, manufacturing and supplying nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium; Technical consultation in the process techniques and uses of developing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium
