Serial Number
88891906
Owner
Ventec Electronics (Suzhou) Co., Ltd.Attorney
Boris Umansky, Esq.Filing Date
Apr 28, 2020
AUTOLAM Trademark
Serial Number: 88891906 • Registration: 7830835
Trademark Classes
Owner Contact Info
308 Taishan Road, New District
Suzhou City, Jiangsu 215129 , CN
Entity Type: 16
Legal Representation
Correspondence Address
Boris Umansky, Esq. LADAS & PARRY LLP
224 South Michigan Avenue
Suite 1600
Chicago, IL 60604
UNITED STATES
Trademark Details
Filing Date
April 28, 2020
Registration Date
June 17, 2025
Published for Opposition
April 29, 2025
Goods & Services
Electrical insulating materials; base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of circuit boards, namely, semi-processed plastic; plastic materials in the form of plates and sheets for use in the manufacture of circuit boards
Design of electrical insulating materials, base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of circuit boards, namely, semi-processed plastic, plastic materials in the form of plates and sheets for use in the manufacture of circuit boards
