Serial Number
97551975
Owner
ASIA VITAL COMPONENTS CO., LTD.Attorney
Gene BolmarcichFirst Use Date
Aug 18, 2023
Filing Date
Aug 17, 2022
ASIA VITAL COMPONENTS Trademark
Serial Number: 97551975 • Registration: 7329153
Trademark Classes
Owner Contact Info
7F-3, No. 24, WU-CHUAN 2Rd.
HSIN CHUNG CITY, TAIPEI HSIEN , TW
Entity Type: 03
Legal Representation
Trademark Details
Filing Date
August 17, 2022
Registration Date
March 12, 2024
First Use Anywhere
August 18, 2023
First Use in Commerce
August 25, 2023
Published for Opposition
July 11, 2023
Goods & Services
Radiators in the nature of heat sinks for use in computers and electronic components; heat dissipating fans, namely, internal cooling fans for computers; cooling fins being structural parts of heat sinks for use in computers and electronic components; vapor chambers in the nature of condensers for dissipating heat in computer equipment and electronic equipment; water-cooling devices, namely, all-in-one (AIO) liquid coolers for central processing units to dissipate heat in computers; heat plates for dissipating heat in computer equipment and electronic equipment; heat-dissipating devices, namely, central processing unit (CPU) coolers, heat sinks for use in computers and electronic components, internal cooling fans for computers and notebook computer cooling pads; roll-bond plates being structural parts of heat exchangers specially adapted for computers and electronic components for dissipating heat in computer equipment and electronic equipment; heat pipes being heat exchangers specially adapted for computers and electronic components for dissipating heat in computer equipment and electronic equipment; radiation fins being structural parts of heat sinks for use in computers and electronic components; electrical fan controlling devices; fasteners, namely, mounting brackets and screws specially adapted for computer heat sinks; electronic facial recognition apparatus, namely, computer hardware and recorded computer software for facial recognition; computer chassis; housings for computers; computer cases; heat-dissipating devices being adapted for electronic mobile computing devices for dissipating heat; vapor chambers being adapted for electronic mobile computing devices for dissipating heat; heat pipes being adapted for electronic mobile computing devices for dissipating heat; and heat sinks for electric vehicle batteries