ALCSP
LIVE

Serial Number

79070214

Owner

Elpida Memory, Inc.

Attorney

Jeffrey H. Kaufman

Filing Date

Dec 22, 2008

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ALCSP Trademark

Serial Number: 79070214 • Registration: 3856878

ALCSP is a trademark filed by Elpida Memory, Inc. on December 22, 2008. The trademark is classified under Class 9 (Computers & Electronics), Class 40 (Treatment & Processing), Class 42 (Computer & Scientific). The application is currently registered and active.

Owner Contact Info

Elpida Memory, Inc. (7 trademarks)

2-1, Yaesu 2-chome

Entity Type: 03

Trademark Details

Filing Date

December 22, 2008

Registration Date

October 5, 2010

Published for Opposition

July 20, 2010

Cancellation Date

December 23, 2018

Goods & Services

Assembly of products for others, namely, semiconductor devices and semiconductor device packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling for others in the field of integrated circuits and integrated circuit packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling of semi-conductors and integrated circuits for others; manufacturing and assembling of semi-conductors for others; manufacturing and assembling of structured semiconductor wafers for others; providing information about manufacturing services for others in the field of semiconductors; providing information about manufacturing services for others in the field of semiconductor power elements; providing information about manufacturing services for others in the field of integrated circuits; providing information about manufacturing services for others in the field of structured semiconductor wafers

Semiconductor devices; semiconductor chips; integrated circuits; integrated circuit chips, namely, integrated circuit chips for use in electronic integrated circuits; integrated circuit chips for use in circuit boards; integrated circuit chips for use in integrated circuit cards; integrated circuit chips for use in integrated circuit modules; integrated circuit chips for use as a component of computers, computer workstations, server computers, personal computers, computer peripheral equipment, digital appliances, digital consumer electronic devices, digital home electrical appliances, mobile computers, video game consoles, home video game machines, mechatronic devices, electronic business equipment, electronic industrial instruments, office automation equipment, computer networking hardware, automobile electronic in-car devices, vehicle equipment, sensors, integrated circuit cards, point-of-sale terminals, printers, hard disk drives, digital audio-visual equipment, digital televisions, digital audio players, digital still cameras, optical and magneto-optical disc players and records digital video cameras, DVD recorder/players, HDD recorders, telephones, fax machines, mobile phones, car audio equipment, car navigation computers, and personal navigation computers; integrated circuit modules; integrated circuit packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); semiconductor memory; dynamic random access memory; semiconductor memory units; dynamic random access memory modules; electronic circuits; large scale integrated circuits; semiconductor wafers; integrated circuit (IC) memories, namely, semi-conductor memory units for integrated circuits; computer software for designing of integrated circuits

Design for others in the field of semiconductor device packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); testing, inspection or research on semiconductor power elements, semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuits; design for others in the field of semi-conductors, semiconductor power elements and integrated circuits; providing on-line non-downloadable computer programs for designing of processing technology, processing devices and electric circuit modeling of integrated circuits, namely, software for use in the design and manufacture of integrated circuits; providing information about product development and design for others in the field of semiconductor integrated circuits; providing information about inspection of semi-conductors; providing information about designing of semi-conductors for others; advisory and consultancy services relating to the designing of integrated circuits for others; product research and development and design for others in the field of semiconductor elements, integrated circuit and electronic circuits, advisory, consultancy and information services relating to product research and development and design for others in the field of semiconductor elements, integrated circuits and electronic circuits

Filing History

NOTIFICATION OF EFFECT OF CANCELLATION OF INTL REG E-MAILED
Jul 12, 2019 DENC
DEATH OF INTERNATIONAL REGISTRATION
Jul 12, 2019 DETH
TOTAL INVALIDATION PROCESSED BY THE IB
Feb 23, 2018 INNT
TOTAL INVALIDATION OF REG EXT PROTECTION SENT TO IB
Jan 24, 2018 INTS
INVALIDATION PROCESSED
Jan 24, 2018 INPC
TOTAL INVALIDATION OF REG EXT PROTECTION CREATED
Jan 12, 2018 INTR
CANCELLED SECTION 71
May 12, 2017 C71T
COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
Oct 5, 2015 REM3
TEAS CHANGE OF CORRESPONDENCE RECEIVED
Feb 11, 2015 TCCA
FINAL DECISION TRANSACTION PROCESSED BY IB
Feb 12, 2013 FINO
FINAL DISPOSITION NOTICE SENT TO IB
Jan 10, 2011 FICS
FINAL DISPOSITION PROCESSED
Jan 6, 2011 FIMP
FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
Jan 5, 2011 FICR
REGISTERED-PRINCIPAL REGISTER
Oct 5, 2010 R.PR
OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Jul 20, 2010 NPUB
PUBLISHED FOR OPPOSITION
Jul 20, 2010 PUBO
LAW OFFICE PUBLICATION REVIEW COMPLETED
Jun 15, 2010 PREV
APPROVED FOR PUB - PRINCIPAL REGISTER
Jun 14, 2010 CNSA
TEAS/EMAIL CORRESPONDENCE ENTERED
Jun 8, 2010 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Jun 8, 2010 CRFA
TEAS REQUEST FOR RECONSIDERATION RECEIVED
Jun 8, 2010 ERFR
NOTIFICATION OF FINAL REFUSAL EMAILED
Mar 26, 2010 GNFN
FINAL REFUSAL E-MAILED
Mar 26, 2010 GNFR
FINAL REFUSAL WRITTEN
Mar 26, 2010 CNFR
TEAS/EMAIL CORRESPONDENCE ENTERED
Mar 3, 2010 TEME
CORRESPONDENCE RECEIVED IN LAW OFFICE
Mar 3, 2010 CRFA
ASSIGNED TO LIE
Mar 3, 2010 ALIE
TEAS CHANGE OF CORRESPONDENCE RECEIVED
Feb 5, 2010 TCCA
TEAS RESPONSE TO OFFICE ACTION RECEIVED
Feb 5, 2010 TROA
REFUSAL PROCESSED BY IB
Sep 4, 2009 RFNT
NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Aug 7, 2009 RFCS
REFUSAL PROCESSED BY MPU
Aug 6, 2009 RFRR
NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Aug 6, 2009 RFCR
NON-FINAL ACTION WRITTEN
Aug 5, 2009 CNRT
APPLICATION FILING RECEIPT MAILED
Jul 31, 2009 MAFR
ASSIGNED TO EXAMINER
Jul 27, 2009 DOCK
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Jul 27, 2009 NWOS
LIMITATION OF GOODS/SERVICES FROM IB ENTERED
Jul 24, 2009 LIMS
SN ASSIGNED FOR SECT 66A APPL FROM IB
Jul 23, 2009 REPR