AEGIS COOLING Trademark

Cooling devices, namely, a cooler for cooling electronic components, namely, processors and integrated circuits; Cooling systems in the nature of direct contact liquid cooling evaporators for electronic devices, namely, computer processors, computer memory, and power supplies; Liquid cooling apparatus in the nature of heat exchangers with connecting tubes being computer heat sinks, which also include cooling pads and internal cooling fans for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; cooling elements in the nature of heat exchangers with connecting tubes being computer heat sinks which also include cooling pads and internal cooling fans for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; cooling and machines, namely heat exchangers being computer heat sinks, which also include cooling pads and internal cooling fans for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; cooling appliances and installations, namely, heat exchangers being computer heat sinks, which also include cooling pads and internal cooling fans for cooling computers, computer hardware, computer peripherals, computer servers, blade servers, and electronic equipment; Computer hardware using liquid cooling technology; Modular racks in the nature of mounting racks for computer hardware filled with coolant or refrigerant for cooling computer equipment; Data center infrastructure management and control systems in the nature of computer hardware and downloadable and recorded computer software for controlling the temperature and environmental conditions of data centers and cooling equipment for data centers; Components, assemblies, and systems for cooling data centers, namely, heat sinks for use in computers and electronic components; Cooling devices for computer hardware and telecommunication equipment, namely, internal cooling fans for computers and electronic components; Heat sinks in the nature of cooling installations for computer equipment in the nature of computers and electronic components filled with liquid for cooling computer equipment; Cooling installations, namely, liquid cooling system comprised of liquid cooled heat sinks and internal cooling fans for use inside modular racks for cooling computer hardware equipment; Cooling installations comprised of liquid cooled heat sinks and internal cooling fans for distributing a coolant to computer hardware equipment and other electronic devices that generate heat, namely, CPUs, GPUs, memory and any other processors or chips; Cooling systems in the nature of liquid cooling apparatus and cooling installations comprised of liquid cooled heat sinks and internal cooling fans for cooling computer hardware and electronic components in the nature of server racks; Modular cooling distribution systems in the nature of cooling installations comprised primarily of a heat sink filled with liquid and also including a pump module in the nature of a heat pump, and an evaporative heat rejection unit in the nature of a cooling evaporator for cooling computer hardware and electronic components; Cooling device, namely, a cooler comprised of liquid cooled heat sinks and internal cooling fans for cooling electronic components, namely, processors and integrated circuits; Cooling units and systems comprised of cooling units and heat rejection units in the nature of liquid cooled heat sinks and internal cooling fans for computer hardware and electronic components in the nature of computer server racks; Cooling units comprised primarily of a heat sink filled with liquid and also including a pump module in the nature of a heat pump, and an evaporative heat rejection unit in the nature of a cooling evaporator for cooling computers; Central processing unit (CPU) coolers; Electronic circuit coolers; Computer hardware using liquid submersion cooling technology; Computer apparatus in the nature of cooling systems for computers comprised of circuit boards, power supplies, microprocessors, central processing unit (CPU) coolers, heat sinks for use in computers, heat sinks for use in electronic components and automatic liquid-flow control machines and instruments