3D INCITES
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3D INCITES Trademark

Serial Number: 99713273

3D INCITES is a trademark filed by International Microelectronics and Packaging Society on March 19, 2026. The trademark is classified under Class 41 (Education & Entertainment), Class 42 (Computer & Scientific). The application is currently pending registration.

Owner Contact Info

International Microelectronics and Packaging Society (8 trademarks)

PO Box 14727
Pittsburgh, PA 15234

Entity Type: 03

Trademark Details

Filing Date

March 19, 2026

Registration Date

Not Registered

Goods & Services

Creating and hosting an on-line membership community web site for members of the semiconductor supply chain to share and access content in the fields of advanced packaging, 3D and chiplet integration and heterogenous integration technologies

Providing recognition and incentives by the way of awards to demonstrate excellence in the field of heterogenous integration technologies; Providing a website featuring blogs and non-downloadable publications in the nature of articles, book reviews and white papers in the field(s) of advanced packaging, 3D and chiplet integration and heterogenous integration technologies; Providing online non-downloadable educational podcasts in the field of advanced packaging, 3D and chiplet integration and heterogenous integration technologies

Filing History

NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Aug 10, 2026 GNEN
EXAMINER'S AMENDMENT ENTERED
Aug 10, 2026 XAEC
EXAMINERS AMENDMENT E-MAILED
Aug 10, 2026 GNEA
EXAMINERS AMENDMENT -WRITTEN
Aug 10, 2026 CNEA
ASSIGNED TO EXAMINER
Aug 1, 2026 DOCK
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Jul 31, 2026 NWOS
APPLICATION FILING RECEIPT MAILED
Mar 19, 2026 MAFR
NEW APPLICATION ENTERED
Mar 19, 2026 NWAP