Chongqing Boyuan Innovation Semiconductor Co. Ltd. – Trademark Portfolio
Entity Type: 99
Chongqing Boyuan Innovation Semiconductor Co. Ltd. holds 1 U.S. trademark filed with the United States Patent and Trademark Office (USPTO), with a strong focus on Class 9 (Computers & Electronics) — 1 filings in this category. Currently, 1 trademark is registered. Notable registered marks include B BONYSS. The owner is based in Chongqing.
No.4,2nd Fl. Block 1, 57 Jinfu Rd,
Guna Street,Qijiang District,
Chongqing 401420 , CN
Showing of trademarks Trademarks
Trademark Classifications
Chongqing Boyuan Innovation Semiconductor Co. Ltd.'s trademark portfolio spans 1 Nice Classification class, reflecting the scope of goods and services protected under their brand portfolio.
Scientific, nautical, surveying, photographic, cinematographic, optical apparatus and instruments
Frequently Asked Questions
How many trademarks does Chongqing Boyuan Innovation Semiconductor Co. Ltd. have?
Chongqing Boyuan Innovation Semiconductor Co. Ltd. has 1 U.S. trademark filed with the USPTO. Of these, 1 registered.
What trademark classes does Chongqing Boyuan Innovation Semiconductor Co. Ltd. file in?
Chongqing Boyuan Innovation Semiconductor Co. Ltd. files trademarks across 1 Nice Classification class. The most active classes are Class 9 (Computers & Electronics). Class 9 covers scientific, nautical, surveying, photographic, cinematographic, optical apparatus and instruments.
What are Chongqing Boyuan Innovation Semiconductor Co. Ltd.'s most well-known trademarks?
Chongqing Boyuan Innovation Semiconductor Co. Ltd.'s registered trademark portfolio includes well-known marks such as B BONYSS. These are among 1 currently registered trademark in the portfolio.
What is Chongqing Boyuan Innovation Semiconductor Co. Ltd.'s trademark registration success rate?
Chongqing Boyuan Innovation Semiconductor Co. Ltd. has a 100% trademark registration rate, with 1 out of 1 resolved applications resulting in successful registration. Currently, 0 applications are pending review.